EP 0858973 B1 19991208 - Lead and cadmium-free encapsulant composition
Title (en)
Lead and cadmium-free encapsulant composition
Title (de)
Blei- und Cadmiumfreie Abdichtungszusammensetzung
Title (fr)
Composition d'encapsulage exempte de plomb et cadmium
Publication
Application
Priority
US 79874697 A 19970213
Abstract (en)
[origin: US5753571A] A lead and cadmium-free encapsulant glass composition consisting essentially of by weight %, 60-80% Bi2O3, 6-14% SiO2, 5-12% B2O3, 5-10% Al2O3 and 0-4% ZnO.\!
IPC 1-7
IPC 8 full level
C03C 8/04 (2006.01); C03C 3/064 (2006.01); C03C 8/24 (2006.01)
CPC (source: EP KR US)
C03C 3/064 (2013.01 - EP KR US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
US 5753571 A 19980519; CN 1094907 C 20021127; CN 1192462 A 19980909; DE 69800045 D1 20000113; DE 69800045 T2 20000803; EP 0858973 A1 19980819; EP 0858973 B1 19991208; JP 2891977 B2 19990517; JP H10231141 A 19980902; KR 100236424 B1 19991215; KR 19980071286 A 19981026; TW 538012 B 20030621
DOCDB simple family (application)
US 79874697 A 19970213; CN 98105654 A 19980213; DE 69800045 T 19980204; EP 98101883 A 19980204; JP 3143098 A 19980213; KR 19980004142 A 19980212; TW 87101949 A 19980212