EP 0859953 A1 19980826 - PROCESS AND CIRCUIT ARRANGEMENT FOR TESTING SOLDER JOINTS
Title (en)
PROCESS AND CIRCUIT ARRANGEMENT FOR TESTING SOLDER JOINTS
Title (de)
VERFAHREN UND SCHALTUNGSANORDNUNG ZUR PRÜFUNG VON LÖTSTELLEN
Title (fr)
PROCEDE ET CIRCUITERIE POUR TESTER DES BRASURES
Publication
Application
Priority
- DE 19541322 A 19951106
- EP 9604853 W 19961106
Abstract (en)
[origin: US6185273B1] The invention concerns a process and circuit arrangement for testing solder joints, preferably on printed circuit boards, whereby the quality of the solder joints is examined for defects using X-rays and qualitative information on the individual solder joints is obtained. According to the invention, the qualitative and/or the measured values of the individual solder joints that characterize the measured physical parameters of the tested solder joints, are used to control the manufacture of further solder joints in the production process in which solder joints are tested.
IPC 1-7
IPC 8 full level
G01N 23/18 (2006.01); G01R 31/304 (2006.01); H05K 13/08 (2006.01)
CPC (source: EP US)
G01N 23/083 (2013.01 - EP US); G01N 23/18 (2013.01 - EP US); G01R 31/304 (2013.01 - EP US); H05K 13/082 (2018.08 - EP US)
Designated contracting state (EPC)
AT BE CH DE FR GB IE IT LI SE
DOCDB simple family (publication)
WO 9717605 A1 19970515; AT E196547 T1 20001015; DE 29623488 U1 19980917; DE 59605926 D1 20001026; EP 0859953 A1 19980826; EP 0859953 B1 20000920; US 6185273 B1 20010206
DOCDB simple family (application)
EP 9604853 W 19961106; AT 96938117 T 19961106; DE 29623488 U 19961106; DE 59605926 T 19961106; EP 96938117 A 19961106; US 6829598 A 19981026