Global Patent Index - EP 0861503 B1

EP 0861503 B1 20020227 - ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT COMPRISING STAGGERED CONTACTS

Title (en)

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT COMPRISING STAGGERED CONTACTS

Title (de)

SCHUTZSTRUKTUR MIT VERSETZTEN KONTAKTEN ZUM SCHUTZ VOR ELEKTROSTATISCHER ENTLADUNG

Title (fr)

CIRCUIT DE PROTECTION CONTRE LES DECHARGES ELECTROSTATIQUES A CONTACTS ECHELONNES

Publication

EP 0861503 B1 20020227 (EN)

Application

EP 96939640 A 19961113

Priority

  • US 9618049 W 19961113
  • US 55918495 A 19951113

Abstract (en)

[origin: WO9718587A1] A method and apparatus for increasing the number of contacts provided between two conductive layers separated by an insulator in a semiconductor integrated circuit chip is disclosed. In a first row of contacts, each contact (314) in the row is separated by a distance, L. A second row of contacts is formed parallel to the first row. Each contact (310, 312) in the second row is spaced a distance of L from other contacts in the row. However, the second row is staggered from the first row, such that each contact is halfway between adjacent contacts in the first row. Each contact in the second row is located a distance of L from the two closest contacts in the first row. Successive rows are formed in similar staggered manner.

IPC 1-7

H01L 23/522; H01L 27/02

IPC 8 full level

H01L 23/52 (2006.01); H01L 21/3205 (2006.01); H01L 21/822 (2006.01); H01L 23/522 (2006.01); H01L 27/04 (2006.01); H10B 12/00 (2023.01)

CPC (source: EP KR US)

H01L 23/5226 (2013.01 - EP US); H01L 27/04 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Citation (examination)

US 5449939 A 19950912 - HORIGUCHI YOKO [JP], et al

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9718587 A1 19970522; AT E213872 T1 20020315; AU 7676796 A 19970605; DE 69619541 D1 20020404; DE 69619541 T2 20020829; EP 0861503 A1 19980902; EP 0861503 B1 20020227; JP 4041873 B2 20080206; JP H11504765 A 19990427; KR 100298820 B1 20011102; KR 19990067503 A 19990825; US 5801421 A 19980901

DOCDB simple family (application)

US 9618049 W 19961113; AT 96939640 T 19961113; AU 7676796 A 19961113; DE 69619541 T 19961113; EP 96939640 A 19961113; JP 51897197 A 19961113; KR 19980703525 A 19980512; US 85027897 A 19970505