EP 0866487 A1 19980923 - Method of making electronic and glass structures on glass substrates
Title (en)
Method of making electronic and glass structures on glass substrates
Title (de)
Verfahren zur Herstellung von elektronische - und Glasstrukturen auf Glassubstraten
Title (fr)
Procédé de fabrication de structures électroniques et en verre sur des substrats en verre
Publication
Application
Priority
US 82020697 A 19970318
Abstract (en)
Electronic and glass structures are formed by forming a recessed pattern on a flat glass substrate using a recessed imaging surface, and the resultant recessed pattern on the glass is filled with an electrically conductive material to form electrodes. Barrier ribs may then be formed between the electrodes using a recessed imaging surface. <IMAGE>
IPC 1-7
IPC 8 full level
B81C 1/00 (2006.01); C03C 17/04 (2006.01)
CPC (source: EP US)
B81C 1/00111 (2013.01 - EP US); C03C 17/04 (2013.01 - EP US); B81C 2201/036 (2013.01 - EP US); H01J 2211/36 (2013.01 - EP US)
Citation (search report)
- [PA] EP 0802170 A2 19971022 - CORNING INC [US]
- [A] EP 0452118 A1 19911016 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [A] US 3926763 A 19751216 - REISMAN ARNOLD
- [A] US 3781984 A 19740101 - MAEDA T, et al
- [A] FR 2708170 A1 19950127 - INNOVATION DEV CIE GLE [FR]
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 97402568 A 19971029; US 82020697 A 19970318