EP 0868744 A1 19981007 - PROCESS FOR PRODUCING CONTACTS ON ELECTRICAL COMPONENTS SUITABLE FOR A FLIP-CHIP ASSEMBLY
Title (en)
PROCESS FOR PRODUCING CONTACTS ON ELECTRICAL COMPONENTS SUITABLE FOR A FLIP-CHIP ASSEMBLY
Title (de)
VERFAHREN ZUR HERSTELLUNG VON FÜR EINE FLIP- CHIP-MONTAGE GEEIGNETEN KONTAKTEN VON ELEKTRISCHEN BAUELEMENTEN
Title (fr)
PROCEDE DE PRODUCTION DE CONTACTS DE COMPOSANTS ELECTRIQUES, CONVENANT AU MONTAGE PAR BOSSES SOUDEES
Publication
Application
Priority
- DE 9602412 W 19961216
- DE 19548046 A 19951221
Abstract (en)
[origin: DE19548046A1] In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable layers (4) in contact with pads of the electrically conductive structures (3) are applied.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/31 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01)
CPC (source: EP KR US)
H01L 21/56 (2013.01 - KR); H01L 23/3171 (2013.01 - EP US); H03H 3/08 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
See references of WO 9723904A1
Designated contracting state (EPC)
CH DE FR GB LI
DOCDB simple family (publication)
DE 19548046 A1 19970626; DE 19548046 C2 19980115; CA 2241037 A1 19970703; CN 1105397 C 20030409; CN 1205800 A 19990120; EP 0868744 A1 19981007; JP 2000502238 A 20000222; JP 4413278 B2 20100210; KR 100445569 B1 20041015; KR 19990072096 A 19990927; US 6057222 A 20000502; WO 9723904 A1 19970703
DOCDB simple family (application)
DE 19548046 A 19951221; CA 2241037 A 19961216; CN 96199161 A 19961216; DE 9602412 W 19961216; EP 96946147 A 19961216; JP 52321297 A 19961216; KR 19980704406 A 19980612; US 10316398 A 19980622