EP 0868837 A1 19981007 - NEW METHOD OF FORMING FINE CIRCUIT LINES
Title (en)
NEW METHOD OF FORMING FINE CIRCUIT LINES
Title (de)
NEUES VERFAHREN ZUR HERSTELLUNG FEINER LEITERBAHNEN
Title (fr)
NOUVEAU PROCEDE DE FORMATION DE FINES LIGNES DE CIRCUIT
Publication
Application
Priority
- US 9707191 W 19970501
- US 1666596 P 19960501
- US 84638097 A 19970430
Abstract (en)
[origin: WO9741713A1] A new method of forming circuit lines on a substrate by applying conductive metal(s) using copper foil as a carrier. The copper foil is etched away, leaving the conductive metals embedded in the surface of the substrate. A photoresist is used to expose trenches which define the desired circuit and copper is applied onto the exposed conductive metals. The method is particularly suited to manufacturing the outer layers of multi-layer circuit boards.
IPC 1-7
IPC 8 full level
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H05K 3/025 (2013.01); H05K 3/108 (2013.01); H05K 3/384 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/0344 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10477 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0726 (2013.01)
Citation (search report)
See references of WO 9741713A1
Designated contracting state (EPC)
CH DE DK ES FR GB IT LI SE
DOCDB simple family (publication)
WO 9741713 A1 19971106; AU 2993997 A 19971119; EP 0868837 A1 19981007
DOCDB simple family (application)
US 9707191 W 19970501; AU 2993997 A 19970501; EP 97924540 A 19970501