EP 0870329 A1 19981014 - EPOXY RESIN BASED SOLDER PASTE
Title (en)
EPOXY RESIN BASED SOLDER PASTE
Title (de)
Lötpaste auf Epoxidharzbasis
Title (fr)
PATE A SOUDER A BASE DE RESINE EPOXY
Publication
Application
Priority
- US 9612761 W 19960809
- US 51404995 A 19950811
- US 64491196 A 19960528
Abstract (en)
[origin: WO9707542A1] A method of making low and high mass assemblies at surface mount profile conditions utilizing a solder paste have a binder comprised of a thermosetting resin and cross-linking agent that also acts as a flux is described. The method of selecting the components and specific binders, including binders with a catalyst such as tin octoate are also described. The binder utilized has a gel point that is at or above the melting point of the solder powder and most preferably above such melting point.
IPC 1-7
H01L 23/488; H01B 1/06; B05D 5/12; B32B 27/38; B32B 15/08; C08G 59/68; C08G 59/40
IPC 8 full level
B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); B23K 35/02 (2006.01); B23K 35/22 (2006.01); B23K 35/36 (2006.01); B23K 35/363 (2006.01); C08G 59/68 (2006.01); H01L 21/56 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP KR)
B23K 35/025 (2013.01 - EP); B23K 35/3613 (2013.01 - EP); H01L 21/563 (2013.01 - EP); H01L 23/48 (2013.01 - KR); H01L 24/29 (2013.01 - EP); H05K 3/285 (2013.01 - EP); H05K 3/3485 (2020.08 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2924/01012 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01077 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01087 (2013.01 - EP); H01L 2924/01322 (2013.01 - EP); H01L 2924/01327 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/351 (2013.01 - EP); H05K 3/321 (2013.01 - EP); H05K 2201/10977 (2013.01 - EP)
Citation (search report)
See references of WO 9707542A1
Designated contracting state (EPC)
DE DK FR GB IE IT NL SE
DOCDB simple family (publication)
WO 9707542 A1 19970227; EP 0870329 A1 19981014; JP 2001517153 A 20011002; KR 19990036355 A 19990525
DOCDB simple family (application)
US 9612761 W 19960809; EP 96928056 A 19960809; JP 50933497 A 19960809; KR 19980701023 A 19980211