Global Patent Index - EP 0874712 A1

EP 0874712 A1 19981104 - LASER CUTTING METHOD AND DEVICE

Title (en)

LASER CUTTING METHOD AND DEVICE

Title (de)

VERFAHREN UND VORRICHTUNG ZUM LASERSCHNEIDEN

Title (fr)

PROCEDE ET DISPOSITIF DE DECOUPE LASER

Publication

EP 0874712 A1 19981104 (FR)

Application

EP 97900222 A 19970102

Priority

  • FR 9700004 W 19970102
  • FR 9600177 A 19960104

Abstract (en)

[origin: WO9725178A1] A laser cutting method using a cutting head (10) comprising a laser beam source (F) such as a carbon dioxide laser, and an oxygen feed nozzle (13). To cut thick products (1), e.g. made of a ceramic or iron-carbon alloy, a cooling fluid (19) such as water is delivered onto the surface of the product to be cut on the cutting head side thereof and a negative pressure of at least 0.25 bars relative to the pressure on the cutting head side is generated on the other side of said product. The negative pressure is generated, e.g., by means of a pressure-regulated suction chamber (20) in sealing engagement with the product surface. The method is useful for laser cutting thick products such as steel sheets having a thickness of 10-30 mm.

IPC 1-7

B23K 26/14

IPC 8 full level

B23K 26/14 (2006.01); B23K 26/38 (2006.01)

CPC (source: EP)

B23K 26/146 (2015.10); B23K 26/38 (2013.01); B23K 2103/04 (2018.07); B23K 2103/06 (2018.07)

Citation (search report)

See references of WO 9725178A1

Designated contracting state (EPC)

BE DE ES FR GB IT

DOCDB simple family (publication)

WO 9725178 A1 19970717; AU 1382297 A 19970801; EP 0874712 A1 19981104; FR 2743318 A1 19970711; FR 2743318 B1 19980130

DOCDB simple family (application)

FR 9700004 W 19970102; AU 1382297 A 19970102; EP 97900222 A 19970102; FR 9600177 A 19960104