EP 0877423 A2 19981111 - Integrated circuit package
Title (en)
Integrated circuit package
Title (de)
Verpackung für integrierte Schaltung
Title (fr)
Empaquetage de cicuit intégré
Publication
Application
Priority
US 4565897 P 19970506
Abstract (en)
An integrated circuit package has a metal carrier plate (1) and a patterned and metallized film (2) wrapped around the carrier plate. The film is metallized on one side with conductive traces (5) and on an opposite side with a conductive plane (7). The carrier plate and film are overmolded with a plastic package housing (8) exposing a portion (13) of the conductive traces (5). An IC die is disposed on the carrier plate and wirebonded to the conductive traces. A plastic cover (17) is ultrasonically welded to the housing (8) enclosing the IC die. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/50 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP)
H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/4985 (2013.01); H01L 23/49861 (2013.01); H01L 2924/0002 (2013.01)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0877423 A2 19981111; EP 0877423 A3 19990811; JP H10321745 A 19981204
DOCDB simple family (application)
EP 98303528 A 19980506; JP 11737498 A 19980427