Global Patent Index - EP 0877709 A4

EP 0877709 A4 2000-04-05 - SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK

Title (en)

SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK

Title (de)

FLEXIBLE VERPACKUNG UND SPENDER FÜR FLÜSSIGE PHOTOEMPFINDLICHE LÖTSTOPMASKE

Title (fr)

CONDITIONNEMENT A ENVELOPPE SOUPLE ET SYSTEME DE DISTRIBUTION DE MASQUE DE SOUDAGE LIQUIDE PHOTOSENSIBLE

Publication

EP 0877709 A4 (EN)

Application

EP 97901958 A

Priority

  • US 9700319 W
  • US 59384196 A

Abstract (en)

[origin: WO9728053A1] A method and system for preparing and dispensing to a screen printer a solder mask reaction product which product is made by reacting at least two components (17 and 18) comprises a single pliable container (10) which holds the components and is partitioned (19) to separate the reactive components, removing the partition when the solder mask is ready to be made, missing the reactive components in the container, transferring the mixed components to a mixing container if necessary and completing the mixing to form a substantially homogeneous solder mask blend and dispensing the homogeneous solder mask blend to the screen printing device. A package for making a solder mask reaction product, a package containing a mixed or partially-mixed solder mask reaction product and an apparatus for preparing and dispensing the solder mask reaction product are also provided.

IPC 1-7 (main, further and additional classification)

B65D 25/08; B65D 81/32; G03F 7/16

IPC 8 full level (invention and additional information)

B01F 11/00 (2006.01); B01F 13/00 (2006.01); B01F 15/02 (2006.01); B65D 30/22 (2006.01); B65D 81/32 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01)

CPC (invention and additional information)

H05K 3/0091 (2013.01); B01F 11/0065 (2013.01); B01F 13/002 (2013.01); B01F 15/0205 (2013.01); B01F 15/0208 (2013.01); B65D 81/3266 (2013.01); H05K 3/1233 (2013.01); H05K 3/285 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/1163 (2013.01); H05K 2203/159 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH DE ES FI FR GB IT LI NL SE

EPO simple patent family

WO 9728053 A1 19970807; AU 1574497 A 19970822; AU 732745 B2 20010426; CA 2244775 A1 19970807; CN 1209783 A 19990303; EP 0877709 A1 19981118; EP 0877709 A4 20000405; IL 124970 A 20010430; IL 124970 D0 19990126; JP 2000503948 A 20000404

INPADOC legal status


2002-03-06 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20010807

2001-01-17 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20001205

2000-04-05 [A4] SUPPLEMENTARY SEARCH REPORT

- Effective date: 20000221

2000-04-05 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A4

- Designated State(s): AT BE CH DE ES FI FR GB IT LI NL SE

2000-04-05 [RIC1] CLASSIFICATION (CORRECTION)

- Free text: 7B 65D 25/08 A, 7G 03F 7/16 B, 7B 65D 81/32 B

1998-11-18 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19980722

1998-11-18 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH DE ES FI FR GB IT LI NL SE