EP 0877709 A4 20000405 - SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK
Title (en)
SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK
Title (de)
FLEXIBLE VERPACKUNG UND SPENDER FÜR FLÜSSIGE PHOTOEMPFINDLICHE LÖTSTOPMASKE
Title (fr)
CONDITIONNEMENT A ENVELOPPE SOUPLE ET SYSTEME DE DISTRIBUTION DE MASQUE DE SOUDAGE LIQUIDE PHOTOSENSIBLE
Publication
Application
Priority
- US 9700319 W 19970110
- US 59384196 A 19960130
Abstract (en)
[origin: WO9728053A1] A method and system for preparing and dispensing to a screen printer a solder mask reaction product which product is made by reacting at least two components (17 and 18) comprises a single pliable container (10) which holds the components and is partitioned (19) to separate the reactive components, removing the partition when the solder mask is ready to be made, missing the reactive components in the container, transferring the mixed components to a mixing container if necessary and completing the mixing to form a substantially homogeneous solder mask blend and dispensing the homogeneous solder mask blend to the screen printing device. A package for making a solder mask reaction product, a package containing a mixed or partially-mixed solder mask reaction product and an apparatus for preparing and dispensing the solder mask reaction product are also provided.
IPC 1-7
IPC 8 full level
B01F 11/00 (2006.01); B01F 13/00 (2006.01); B01F 15/02 (2006.01); B65D 30/22 (2006.01); B65D 81/32 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP KR)
B01F 31/55 (2022.01 - EP); B01F 33/5011 (2022.01 - EP); B01F 35/713 (2022.01 - EP); B01F 35/7133 (2022.01 - EP); B65D 25/08 (2013.01 - KR); B65D 81/3266 (2013.01 - EP); H05K 3/0091 (2013.01 - EP); H05K 3/1233 (2013.01 - EP); H05K 3/285 (2013.01 - EP); H05K 2203/0126 (2013.01 - EP); H05K 2203/1163 (2013.01 - EP); H05K 2203/159 (2013.01 - EP)
Citation (search report)
- [A] DE 4204181 A1 19930819 - DEGUSSA [DE]
- See references of WO 9728053A1
Designated contracting state (EPC)
AT BE CH DE ES FI FR GB IT LI NL SE
DOCDB simple family (publication)
WO 9728053 A1 19970807; AU 1574497 A 19970822; AU 732745 B2 20010426; CA 2244775 A1 19970807; CN 1209783 A 19990303; EP 0877709 A1 19981118; EP 0877709 A4 20000405; IL 124970 A0 19990126; IL 124970 A 20010430; JP 2000503948 A 20000404; KR 100306129 B1 20020808; KR 19990081987 A 19991115
DOCDB simple family (application)
US 9700319 W 19970110; AU 1574497 A 19970110; CA 2244775 A 19970110; CN 97191962 A 19970110; EP 97901958 A 19970110; IL 12497097 A 19970110; JP 52764497 A 19970110; KR 19980705705 A 19980724