EP 0878561 B1 20030903 - Process and apparatus for the regeneration of tin plating solutions
Title (en)
Process and apparatus for the regeneration of tin plating solutions
Title (de)
Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen
Title (fr)
Procédé et dispositif pour la régéneration des solutions de plaçage d'étain
Publication
Application
Priority
DE 19719020 A 19970507
Abstract (en)
[origin: US6120673A] The invention relates to a method and a device for regenerating exhausted tin-plating solutions which contain tin and copper ions, free complexing agent and complexing agent bound to the copper ions, as well as expended and unexpended reducing agent. By means of a suitable rinsing technique, the rinse water of the tin-plating process is concentrated to a 10 to 15 percent dilution of the process solution. The regenerating solution thus produced is fed to an electrolytic cell. The electrolytic cell comprises a cathode chamber, a middle chamber and an anode chamber. The cathode chamber is separated from the middle chamber by an anion-exchange membrane and the anode chamber is separated from the middle chamber by a cation-exchange membrane. The regenerating solution is initially provided in the cathode chamber. Here, the interfering copper component is cathodically deposited. After an appropriate residence time, the regenerating solution, depleted of copper, is transferred by pumping into the middle chamber where tin enrichment is effected by tin ions diffused from the anode chamber through the cation-exchange membrane. The regenerated solution is subsequently fed back into the tin-plating process.
IPC 1-7
IPC 8 full level
B01D 61/44 (2006.01); C02F 1/461 (2006.01); C02F 1/469 (2006.01); C23C 18/16 (2006.01); C25D 21/22 (2006.01)
CPC (source: EP US)
C23C 18/1617 (2013.01 - EP US); C25D 21/22 (2013.01 - EP US); Y10S 204/13 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
US 6120673 A 20000919; AR 010155 A1 20000517; AT E248935 T1 20030915; AU 6475798 A 19981112; AU 724854 B2 20001005; BR 9801580 A 19990706; CA 2236393 A1 19981107; CA 2236393 C 20040120; DE 19719020 A1 19981112; DE 59809451 D1 20031009; DK 0878561 T3 20040112; EP 0878561 A2 19981118; EP 0878561 A3 19990428; EP 0878561 B1 20030903; ES 2202686 T3 20040401; JP H10317154 A 19981202; PT 878561 E 20040227
DOCDB simple family (application)
US 7472598 A 19980507; AR P980102075 A 19980504; AT 98107584 T 19980425; AU 6475798 A 19980506; BR 9801580 A 19980505; CA 2236393 A 19980430; DE 19719020 A 19970507; DE 59809451 T 19980425; DK 98107584 T 19980425; EP 98107584 A 19980425; ES 98107584 T 19980425; JP 5827598 A 19980310; PT 98107584 T 19980425