EP 0882108 A1 19981209 - POLYAMIDE BASED LAMINATING, COVERLAY, AND BOND PLY ADHESIVE WITH HEAT ACTIVATED CURE COMPONENT
Title (en)
POLYAMIDE BASED LAMINATING, COVERLAY, AND BOND PLY ADHESIVE WITH HEAT ACTIVATED CURE COMPONENT
Title (de)
LAMINATE-, DECKLAGE- UND BUNDSCHICHT-KLEBSTOFF AUF BASIS VON POLYAMID MIT WÄRMEAKTIVIERBAREN HÄRTUNGSKOMPONENTE
Title (fr)
ADHESIF DE COMPLEXAGE, DE COUCHES DE REVETEMENT ET DE COUCHES DE LIAISON A BASE DE POLYAMIDE AYANT UN COMPOSANT A DURCISSEMENT ACTIVE PAR LA CHALEUR
Publication
Application
Priority
- US 9702701 W 19970221
- US 1216496 P 19960223
Abstract (en)
[origin: WO9731078A1] A high performance laminating, coverlay, and bond ply adhesive which includes a high molecular weight acid terminated thermoplastic polyamide resin, an epoxy, and a high molecular weight polyester component which can be heat cured with silane and aziridine curatives to form an extremely high temperature resistant, flexible, and high bond strength adhesive is disclosed. The adhesive can be used to enhance the characteristics of polyester and polyethylene naphthalate films for use in flexible and rigid board circuitry applications as well as being an excellent adhesive for films such as polyimide for the same applications thus allowing the films to be used at temperature which are capable of withstanding high temperatures. Along with being useful as laminating adhesive, the system is stable at room temperature and thus can be stored as a free film bond ply adhesive or coated on a film for future conversion into laminate or coverlaying of electronic circuitry.
IPC 1-7
C09J 177/12; C09J 167/02; C08G 69/44; C08L 63/00; C09J 163/00; C08G 81/00; C09J 201/10
IPC 8 full level
C08G 69/44 (2006.01); C08G 81/00 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C09J 167/02 (2006.01); C09J 177/12 (2006.01); C09J 179/02 (2006.01); C09J 201/10 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP KR)
C08G 69/44 (2013.01 - EP KR); C08G 81/00 (2013.01 - EP KR); C08L 63/00 (2013.01 - EP); C08L 77/00 (2013.01 - EP); C09J 7/22 (2017.12 - KR); C09J 7/28 (2017.12 - KR); C09J 163/00 (2013.01 - EP); C09J 167/00 (2013.01 - KR); C09J 167/02 (2013.01 - EP); C09J 177/12 (2013.01 - EP KR); C09J 201/10 (2013.01 - EP); C08L 2666/20 (2013.01 - EP); C09J 2400/16 (2013.01 - KR); C09J 2467/00 (2013.01 - KR); H05K 3/386 (2013.01 - EP)
Citation (search report)
See references of WO 9731078A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 9731078 A1 19970828; AU 1966297 A 19970910; EP 0882108 A1 19981209; JP 2001513115 A 20010828; KR 19990087191 A 19991215
DOCDB simple family (application)
US 9702701 W 19970221; AU 1966297 A 19970221; EP 97907743 A 19970221; JP 53033197 A 19970221; KR 19980706586 A 19980822