EP 0887105 B1 20010905 - Device and method for comminution of semiconductive material
Title (en)
Device and method for comminution of semiconductive material
Title (de)
Vorrichtung und Verfahren zum Zerkleinern von Halbleitermaterial
Title (fr)
Dispositif et procédé de fragmentation de matériaux semiconducteur
Publication
Application
Priority
DE 19727441 A 19970627
Abstract (en)
[origin: EP0887105A1] Cutting up semiconductor material comprises direct current passage by pulsed high voltage application using electrodes which consist of the semiconductor material (preferably silicon) and which are made conductive by heating. Also claimed is the apparatus for carrying out the above process, including spaced electrodes (3) having heaters (5).
IPC 1-7
IPC 8 full level
B02C 19/18 (2006.01); B23H 9/00 (2006.01); B28D 5/00 (2006.01); C30B 33/04 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B02C 19/0056 (2013.01 - EP US); B02C 19/18 (2013.01 - EP KR US); B28D 5/00 (2013.01 - EP US); B02C 2019/183 (2013.01 - EP KR US)
Designated contracting state (EPC)
DE IT
DOCDB simple family (publication)
EP 0887105 A1 19981230; EP 0887105 B1 20010905; CN 1209034 A 19990224; DE 19727441 A1 19990107; DE 59801370 D1 20011011; JP 2961694 B2 19991012; JP H1142635 A 19990216; KR 19990006851 A 19990125; TW 387823 B 20000421; US 6024306 A 20000215
DOCDB simple family (application)
EP 98110151 A 19980604; CN 98102651 A 19980624; DE 19727441 A 19970627; DE 59801370 T 19980604; JP 16723098 A 19980615; KR 19980021550 A 19980610; TW 87110208 A 19980624; US 10282998 A 19980623