EP 0892087 A3 20000607 - Electroplating of low-stress nickel
Title (en)
Electroplating of low-stress nickel
Title (de)
Elektrobeschichtung von spannungsarmem Nickel
Title (fr)
Electroplacage de nickel à faibles contraintes
Publication
Application
Priority
- US 5014097 P 19970618
- US 6492398 A 19980423
Abstract (en)
[origin: EP0892087A2] Nickel and nickel alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonic acid and a stress-reducing additive that imparts compressive stress to an electrodeposit. The electroplating bath is acidic with a pH of 0 to 5.
IPC 1-7
IPC 8 full level
C25D 3/12 (2006.01); C25D 21/14 (2006.01)
CPC (source: EP)
C25D 3/12 (2013.01); C25D 21/14 (2013.01)
Citation (search report)
- [A] US 3312604 A 19670404 - HERBERT WELLS FREDERICK, et al
- [A] GB 1213267 A 19701125 - NICKEL LE [FR]
- [A] US 4108740 A 19780822 - WEARMOUTH WILLIAM RONALD
- [A] US 3726768 A 19730410 - LUNDQUIST J, et al
- [DX] KUDRYAVTSEV ET AL.: "Nickel Electrodeposition from Methansulfonic Acid-Based Bath", PROCEEDINGS OF AMERICAN ELECTROPLATERS, SURFACE FINISHING, 1996, pages 837 - 841, XP000884995
- [XA] PATENT ABSTRACTS OF JAPAN vol. 017, no. 446 (C - 1098) 17 August 1993 (1993-08-17)
- [X] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 06 28 June 1996 (1996-06-28)
- [A] PATENT ABSTRACTS OF JAPAN vol. 013, no. 379 (C - 628) 22 August 1989 (1989-08-22)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0892087 A2 19990120; EP 0892087 A3 20000607; CA 2236933 A1 19981218; CN 1142327 C 20040317; CN 1213019 A 19990407; JP H1171695 A 19990316; SG 63851 A1 19990330
DOCDB simple family (application)
EP 98304642 A 19980611; CA 2236933 A 19980610; CN 98114933 A 19980618; JP 18572298 A 19980617; SG 1998001409 A 19980612