Global Patent Index - EP 0895525 A1

EP 0895525 A1 19990210 - THERMOPLASTIC MOULDING COMPOUNDS BASED ON VINYL AROMATIC POLYMERS WITH SYNDIOTACTIC STRUCTURE, LOW-VISCOSITY POLYAMIDES AND POLYPHENYLENE ETHERS MODIFIED WITH POLAR GROUPS

Title (en)

THERMOPLASTIC MOULDING COMPOUNDS BASED ON VINYL AROMATIC POLYMERS WITH SYNDIOTACTIC STRUCTURE, LOW-VISCOSITY POLYAMIDES AND POLYPHENYLENE ETHERS MODIFIED WITH POLAR GROUPS

Title (de)

THERMOPLASTISCHE FORMMASSEN AUF DER BASIS VON VINYLAROMATISCHEN POLYMEREN MIT SYNDIOTAKTISCHER STRUKTUR, NIEDERVISKOSEN POLYAMIDEN UND MIT POLAREN GRUPPEN MODIFIZIERTEN POLYPHENYLENETHERN

Title (fr)

MATIERES DE MOULAGE THERMOPLASTIQUES A BASE DE POLYMERES VINYLAROMATIQUES A STRUCTURE SYNDIOTACTIQUE, DE POLYAMIDES DE FAIBLE VISCOSITE ET D'ETHERS DE POLYPHENYLENE MODIFIES AVEC DES GROUPES POLAIRES

Publication

EP 0895525 A1 19990210 (DE)

Application

EP 97916431 A 19970403

Priority

  • DE 19616075 A 19960423
  • EP 9701671 W 19970403

Abstract (en)

[origin: DE19616075A1] Thermoplastic moulding compounds containing: (A) 5 to 97.9 wt.% of a vinyl aromatic polymer with a syndiotactic structure; (B) 2 to 90 wt.% of a low-viscosity polyamide with a viscosity number in the range from 50 to 150 ml/g; and (C) 0.1 to 50 wt.% of a polyphenylene ether modified with polar groups.

IPC 1-7

C08L 25/02; C08L 71/12; C08L 77/00

IPC 8 full level

C08L 25/00 (2006.01); C08L 25/06 (2006.01); C08L 71/10 (2006.01); C08L 71/12 (2006.01); C08L 77/00 (2006.01)

CPC (source: EP US)

C08L 25/06 (2013.01 - EP US); C08L 71/126 (2013.01 - EP US); C08L 77/00 (2013.01 - EP US); Y10S 525/905 (2013.01 - EP US)

C-Set (source: EP US)

  1. C08L 25/06 + C08L 2666/02
  2. C08L 71/126 + C08L 2666/02
  3. C08L 77/00 + C08L 61/04
  4. C08L 77/00 + C08L 2666/02
  5. C08L 77/00 + C08L 25/00

Citation (search report)

See references of WO 9740097A1

Designated contracting state (EPC)

BE DE ES FR GB IT NL

DOCDB simple family (publication)

DE 19616075 A1 19971030; CN 1216560 A 19990512; EP 0895525 A1 19990210; JP 2000508697 A 20000711; US 6093771 A 20000725; WO 9740097 A1 19971030

DOCDB simple family (application)

DE 19616075 A 19960423; CN 97194065 A 19970403; EP 9701671 W 19970403; EP 97916431 A 19970403; JP 53765597 A 19970403; US 15509098 A 19980921