Title (en)

ELECTRIC COMPONENT IN INTEGRATED CIRCUIT FORM FOR HOT INSERTION IN A SUBSTRATE AND METHODS FOR MANUFACTURING SAME

Title (de)

ELEKTRONISCHE KOMPONENTE IN DER GESTALT EINER INTEGRIERTEN SCHALTUNG ZUM HEISSEN MONTIEREN IN EINEM SUBSTRAT UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

COMPOSANT ELECTRIQUE SOUS FORME DE CIRCUIT INTEGRE POUR INSERTION A CHAUD DANS UN SUBSTRAT ET PROCEDES POUR SA FABRICATION

Publication

EP 0897595 A1 19990224 (FR)

Application

EP 97921930 A 19970505

Priority

• FR 9700789 W 19970505
• FR 9605625 A 19960506

Abstract (en)

[origin: WO9742657A1] The invention discloses an electronic component in the form of a circuit (10, 13) on a chip (1), comprising at least on its inactive surface (4) a thermoplastic or thermosetting heat-reactivatable adhesive coating (5).

IPC 1-7

H01L 23/495; H01L 21/58

IPC 8 full level

H01L 21/58 (2006.01); H01L 23/495 (2006.01)

CPC (source: EP)

H01L 23/49513 (2013.01); H01L 24/31 (2013.01); H01L 24/83 (2013.01); H01L 2224/274 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/8388 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01063 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01094 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01)

Citation (search report)

See references of WO 9742657A1

Designated contracting state (EPC)

DE ES GB IT NL

DOCDB simple family (publication)

WO 9742657 A1 19971113; EP 0897595 A1 19990224; FR 2748350 A1 19971107; FR 2748350 B1 20000713

DOCDB simple family (application)

FR 9700789 W 19970505; EP 97921930 A 19970505; FR 9605625 A 19960506