EP 0897998 B1 20011205 - Reductive nickel bath
Title (en)
Reductive nickel bath
Title (de)
Reduktives Ni-Bad
Title (fr)
Bain de nickel reducteur
Publication
Application
Priority
DE 19733991 A 19970806
Abstract (en)
[origin: EP0897998A2] An aqueous acid, reductive deposition bath (I) for the electroless deposition of nickel, comprises (per litre of bath liquid):(A) 3-10 g nickel in the form of a nickel salt (B) 5-45 g of a hypophosphite as reducing agent (C) 0.4-1 mole of a carboxylic acid and/or hydroxycarboxylic acid including di- and tri-carboxylic acids as a complexant for nickel, (D) 0.5-3 mg lead, tin, arsenic, thallium or molybdenum acetate or sulphate as stabiliser and (E) thiourea, isothiourea or a thiocyanate as an accelerator containing nitrogen, sulphur, alkyl or aryl substituents, present at a molar concentration 1-3 times that of (D).
IPC 1-7
IPC 8 full level
C23C 18/36 (2006.01)
CPC (source: EP)
C23C 18/36 (2013.01)
Designated contracting state (EPC)
AT CH DE LI
DOCDB simple family (publication)
EP 0897998 A2 19990224; EP 0897998 A3 19990512; EP 0897998 B1 20011205; AT E210207 T1 20011215; DE 19733991 A1 19990211; DE 59802304 D1 20020117
DOCDB simple family (application)
EP 98114391 A 19980731; AT 98114391 T 19980731; DE 19733991 A 19970806; DE 59802304 T 19980731