EP 0907767 A1 19990414 - CYANIDE-FREE ELECTROPLATING BATH FOR DEPOSITION OF GOLD AND GOLD ALLOYS
Title (en)
CYANIDE-FREE ELECTROPLATING BATH FOR DEPOSITION OF GOLD AND GOLD ALLOYS
Title (de)
CYANIDFREIES GALVANISCHES BAD ZUR ABSCHEIDUNG VON GOLD UND GOLDLEGIERUNGEN
Title (fr)
BAIN GALVANOPLASTIQUE SANS CYANURE POUR DEPOT D'OR ET D'ALLIAGES D'OR
Publication
Application
Priority
- DE 19629658 A 19960723
- EP 9703903 W 19970721
Abstract (en)
[origin: DE19629658A1] Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulfurous gold complexes that are stable for a relatively long time, can be used with current densities over 1 A/dm<2> and are practically odor-free, are obtained when the sulfurous compounds used are mercaptosulfonic acids, disulfide sulfonic acids or salts thereof.
IPC 1-7
IPC 8 full level
CPC (source: EP KR US)
C25D 3/48 (2013.01 - EP KR US); C25D 3/62 (2013.01 - EP KR US)
Citation (search report)
See references of WO 9803700A1
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
DE 19629658 A1 19980129; DE 19629658 C2 19990114; DE 59706393 D1 20020321; EP 0907767 A1 19990414; EP 0907767 B1 20020213; JP H11513078 A 19991109; KR 20000064256 A 20001106; US 6165342 A 20001226; WO 9803700 A1 19980129
DOCDB simple family (application)
DE 19629658 A 19960723; DE 59706393 T 19970721; EP 9703903 W 19970721; EP 97933686 A 19970721; JP 50656798 A 19970721; KR 19980702064 A 19980320; US 4341698 A 19980602