EP 0907882 A1 19990414 - SEMICONDUCTOR DEVICE
Title (en)
SEMICONDUCTOR DEVICE
Title (de)
HALBLEITER-BAUELEMENT
Title (fr)
COMPOSANT A SEMI-CONDUCTEUR
Publication
Application
Priority
- DE 9701279 W 19970620
- DE 19626081 A 19960628
Abstract (en)
[origin: DE19626081A1] The invention pertains to a semiconductor device consisting of a chip carrier (5) which is made of an electrically insulating material and has an approximately flat chip carrier surface (4) on which is mounted a semiconductor chip (6) with a pressure sensor, and of electrode leads (7) which pass through the chip carrier (5) and are electrically connected to the semiconductor chip (6) in a surface-mountable arrangement. The chip carrier (5) can be periodically closed by a protective cap (28) covering the pressure sensor.
IPC 1-7
IPC 8 full level
G01L 9/00 (2006.01)
CPC (source: EP US)
G01L 19/003 (2013.01 - EP US); G01L 19/0038 (2013.01 - EP US); G01L 19/0084 (2013.01 - EP US); G01L 19/147 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US)
Citation (search report)
See references of WO 9800691A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
DE 19626081 A1 19980102; EP 0907882 A1 19990414; US 6313729 B1 20011106; WO 9800691 A1 19980108
DOCDB simple family (application)
DE 19626081 A 19960628; DE 9701279 W 19970620; EP 97931627 A 19970620; US 18012898 A 19981102