EP 0907893 A1 19990414 - A METHOD OF TESTING AND FITTING ELECTRONIC SURFACE-MOUNTED COMPONENTS
Title (en)
A METHOD OF TESTING AND FITTING ELECTRONIC SURFACE-MOUNTED COMPONENTS
Title (de)
VERFAHREN ZUM PRÜFEN UND ANBRINGEN ELEKTRONISCHER FLACHBAUKOMPONENTEN
Title (fr)
PROCEDE DE CONTROLE ET DE FIXATION DE COMPOSANTS ELECTRONIQUES MONTES EN SURFACE
Publication
Application
Priority
- SE 9701124 W 19970623
- SE 9602486 A 19960624
Abstract (en)
[origin: WO9750001A1] A method of testing and mounting electronic components that are to be surface-mounted. The components include on one side a plurality of contact pads that shall be connected electrically to contact pads on one side of a test board, particularly BGA components and corresponding components. The invention is characterized by applying to the component contact pads (2) a metal (5) which is liquid at room temperature or at an elevated room temperature, in a first method step; lifting the component (1) away from the surface of the metal (5) in a second method step, wherewith part (7) of the liquid metal remains on the component contact pads (2); and bringing the component contact pads (2) provided with the liquid metal into abutment with corresponding contact pads (3) on the test board (4), in a third method step.
IPC 1-7
IPC 8 full level
G01R 31/26 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G09F 9/00 (2006.01); H05K 3/34 (2006.01); G01R 31/28 (2006.01)
CPC (source: EP)
G01R 1/07307 (2013.01); H05K 3/3436 (2013.01); G01R 1/06755 (2013.01); G01R 31/2886 (2013.01); H05K 3/3485 (2020.08); H05K 2201/0215 (2013.01); H05K 2201/035 (2013.01); H05K 2201/10992 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/162 (2013.01); H05K 2203/176 (2013.01); Y02P 70/50 (2015.11)
Citation (search report)
See references of WO 9750001A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9750001 A1 19971231; EP 0907893 A1 19990414; JP 2000513096 A 20001003; SE 515851 C2 20011015; SE 9602486 D0 19960624; SE 9602486 L 19971225
DOCDB simple family (application)
SE 9701124 W 19970623; EP 97930946 A 19970623; JP 50283698 A 19970623; SE 9602486 A 19960624