Global Patent Index - EP 0907965 A1

EP 0907965 A1 19990414 - COMPONENT HOUSING FOR SURFACE MOUNTING A SEMICONDUCTOR COMPONENT

Title (en)

COMPONENT HOUSING FOR SURFACE MOUNTING A SEMICONDUCTOR COMPONENT

Title (de)

BAUELEMENTGEHÄUSE FÜR EINE OBERFLÄCHENMONTAGE EINES HALBLEITER-BAUELEMENTES

Title (fr)

BOITIER DE COMPOSANT POUR MONTER EN SURFACE UN COMPOSANT A SEMICONDUCTEUR

Publication

EP 0907965 A1 19990414 (DE)

Application

EP 97931678 A 19970627

Priority

  • DE 9701358 W 19970627
  • DE 19626082 A 19960628
  • DE 19626098 A 19960628

Abstract (en)

[origin: US6058020A] A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semiconductor chip, preferably having an integrated electronic circuit, secured on the chip carrier area, and electrode terminals having a surface-mountable configuration. The electrode terminals penetrating through the chip carrier and electrically connected to the semiconductor chip. A distance between the component-mounting surface of the printed circuit board and outer delimiting areas of the chip carrier which face the component-mounting surface of the printed circuit board increases continuously from an edge region to a central region of the chip carrier.

IPC 1-7

H01L 23/13

IPC 8 full level

H01L 23/28 (2006.01); H01L 23/047 (2006.01); H01L 23/13 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP US)

H01L 23/047 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 23/24 (2013.01 - EP US); H01L 23/3107 (2013.01 - EP US); H01L 23/49861 (2013.01 - EP US); H05K 3/303 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 2224/05554 (2013.01 - EP US); H01L 2224/056 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/49175 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/10161 (2013.01 - EP US); H01L 2924/15153 (2013.01 - EP US); H01L 2924/15165 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H05K 1/181 (2013.01 - EP US); H05K 2201/09036 (2013.01 - EP US); H05K 2201/10568 (2013.01 - EP US); H05K 2201/10689 (2013.01 - EP US); H05K 2201/10931 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)

C-Set (source: EP US)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/181 + H01L 2924/00012
  3. H01L 2224/48465 + H01L 2224/48247 + H01L 2924/00
  4. H01L 2224/49175 + H01L 2224/48247 + H01L 2924/00
  5. H01L 2224/49175 + H01L 2224/48465 + H01L 2924/00
  6. H01L 2224/48465 + H01L 2224/48091 + H01L 2924/00
  7. H01L 2224/056 + H01L 2924/00014
  8. H01L 2924/00014 + H01L 2224/45099
  9. H01L 2924/00014 + H01L 2224/85399
  10. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/207

Citation (search report)

See references of WO 9800864A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

US 6058020 A 20000502; EP 0907965 A1 19990414; JP H11514153 A 19991130; WO 9800864 A1 19980108

DOCDB simple family (application)

US 22178798 A 19981228; DE 9701358 W 19970627; EP 97931678 A 19970627; JP 50374798 A 19970627