EP 0908077 A1 19990414 - MULTI-LAYER STAMPED ELECTRICALLY CONDUCTIVE CIRCUIT AND METHOD FOR MAKING SAME
Title (en)
MULTI-LAYER STAMPED ELECTRICALLY CONDUCTIVE CIRCUIT AND METHOD FOR MAKING SAME
Title (de)
MEHRSCHICHTIGE GEPRÄGTE ELEKTRISCH LEITFÄHIGE SCHALTUNG UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
CIRCUIT ELECTRIQUEMENT CONDUCTEUR EMBOUTI MULTICOUCHE ET PROCEDE DE FABRICATION ASSOCIE
Publication
Application
Priority
- GB 9701181 W 19970501
- US 64272496 A 19960503
Abstract (en)
[origin: WO9742800A1] A method of making a multi-layer electronic circuit and the circuit made thereby, wherein the method comprises making each of at least two interconnected circuit layers by applying a layer of conductive material (34, 36) on a layer (38) of insulative material using a stamping die which defines a selected pattern in the conductive layer (34, 36), aligning and laminating the circuit layers to a substrate (32), and interconnecting the layers of the conductive material (34, 36) at selected locations. Apertures (40, 42, 44) are defined at selected locations in the insulative material for a subsequent electrical interconnection. These apertures (40, 42, 44) may be defined by stamping them into the insulative material simultaneously with the application of the patterned conductive material on the insulative material.
IPC 1-7
IPC 8 full level
H05K 3/04 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H05K 3/041 (2013.01); H05K 3/4046 (2013.01); H05K 3/4652 (2013.01); H05K 3/4038 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10363 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/063 (2013.01); Y02P 70/50 (2015.11)
Citation (search report)
See references of WO 9742800A1
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
DOCDB simple family (application)
GB 9701181 W 19970501; EP 97918271 A 19970501