EP 0914688 A1 19990512 - PRINTED CIRCUIT BOARD LAYERING CONFIGURATION FOR VERY HIGH BANDWIDTH INTERCONNECT
Title (en)
PRINTED CIRCUIT BOARD LAYERING CONFIGURATION FOR VERY HIGH BANDWIDTH INTERCONNECT
Title (de)
GEDRUCKTE LEITERPLATTE MIT SCHICHTKONFIGURATION FÜR VERBINDUNG MIT SEHR HOHER BANDBREITE
Title (fr)
CONFIGURATION DE DISPOSITION EN COUCHES POUR CARTES IMPRIMEES ASSURANT UNE INTERCONNEXION A BANDE PASSANTE TRES LARGE
Publication
Application
Priority
- US 9711925 W 19970707
- US 67898296 A 19960712
Abstract (en)
[origin: WO9802935A1] A ground plane interconnection is provided on first and second substrates (100, 112), the first and second substrates (100, 112) having respective first and second ground layers (110, 118) disposed on a first surface of each of the first and second substrates (100, 112). A ground conductor strip (120) is disposed on a second surface of the second substrate (112), wherein the ground conductor strip (120) includes a plurality of electrically conductive members (124) which pass through the second substrate (112) to electrically couple the ground conductor strip (120) and the second ground layer (118). The first substrate (100) is positioned with respect to the second substrate (112) such that when the first substrate (100) is placed proximate the second substrate (112), the ground conductor strip (120) electrically couples the first and second ground layers (110, 118) to form a continuous ground plane. A method of forming a reduced-inductance continuous ground plane is also provided.
IPC 1-7
IPC 8 full level
H01P 1/04 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01)
CPC (source: EP US)
H01P 1/047 (2013.01 - EP US); H05K 1/0219 (2013.01 - EP US); H05K 3/361 (2013.01 - EP US); H05K 2201/0715 (2013.01 - EP US); H05K 2201/0919 (2013.01 - EP US); H05K 2201/09354 (2013.01 - EP US); H05K 2201/09618 (2013.01 - EP US); H05K 2201/0979 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
WO 9802935 A1 19980122; EP 0914688 A1 19990512; EP 0914688 A4 20000105; JP 2001502127 A 20010213; US 5808529 A 19980915
DOCDB simple family (application)
US 9711925 W 19970707; EP 97933340 A 19970707; JP 50612298 A 19970707; US 67898296 A 19960712