EP 0916141 B1 20041110 - COMPOSITION FOR PRODUCING A CONDUCTIVE COMPOSITE MATERIAL CONTAINING A POLYANILINE, AND RESULTING COMPOSITE MATERIAL
Title (en)
COMPOSITION FOR PRODUCING A CONDUCTIVE COMPOSITE MATERIAL CONTAINING A POLYANILINE, AND RESULTING COMPOSITE MATERIAL
Title (de)
ZUSAMMENSETZUNG ZUR HERSTELLUNG EINES LEITFÄHIGEN VERBUNDMATERIAL MIT EINEM POLYANILIN UND MIT DIESER ZUSAMMENSETZUNG HERGESTELLTES MATERIAL
Title (fr)
COMPOSITION POUR LA FABRICATION D'UN MATERIAU COMPOSITE CONDUCTEUR CONTENANT UNE POLYANILINE ET MATERIAU COMPOSITE OBTENU A PARTIR DE CETTE COMPOSITION
Publication
Application
Priority
- FR 9701408 W 19970728
- FR 9609521 A 19960729
Abstract (en)
[origin: WO9805040A1] Compositions for producing composite materials containing a polyaniline are disclosed. The compositions consist of a solution of the following components in a solvent such as m-cresol: (a) a conductive polyaniline protonated by a protonating agent capable of promoting polyaniline dissolution in the solvent, e.g. phenylphosphonic acid; (b) an insulating polymer selected, e.g., from cellulose polymers and polyvinyl chlorides, e.g. cellulose acetate; and (c) an insulating plasticiser such as a mixture of dimethyl phthalate, diethyl phthalate and triphenyl phosphate. The solution may be cast and the solvent evaporated off to give a flexible film of conductive composite material having good electrical and mechanical properties.
IPC 1-7
IPC 8 full level
C08K 5/12 (2006.01); C08K 5/42 (2006.01); C08K 5/521 (2006.01); C08L 1/12 (2006.01); C08L 27/06 (2006.01); C08L 79/00 (2006.01); H01B 1/12 (2006.01); H01B 1/20 (2006.01); H01B 5/16 (2006.01); H01B 13/00 (2006.01); H05K 9/00 (2006.01)
CPC (source: EP US)
H01B 1/128 (2013.01 - EP US)
Designated contracting state (EPC)
DE GB IT NL
DOCDB simple family (publication)
WO 9805040 A1 19980205; DE 69731536 D1 20041216; DE 69731536 T2 20051124; EP 0916141 A1 19990519; EP 0916141 B1 20041110; FR 2751660 A1 19980130; FR 2751660 B1 19980828; JP 2001501017 A 20010123; JP 4142106 B2 20080827; US 6235220 B1 20010522
DOCDB simple family (application)
FR 9701408 W 19970728; DE 69731536 T 19970728; EP 97935642 A 19970728; FR 9609521 A 19960729; JP 50856698 A 19970728; US 23073799 A 19990129