EP 0917717 A4 20001108 - SENSORS AND METHODS OF MAKING WAFER SENSORS
Title (en)
SENSORS AND METHODS OF MAKING WAFER SENSORS
Title (de)
SENSOREN UND VERFAHREN ZU DEREN HERSTELLUNG AUS EINEM GEMEINSAMEN WAFER
Title (fr)
CAPTEURS ET PROCEDES DE FABRICATION DE CAPTEURS EN PLAQUETTE
Publication
Application
Priority
- US 9710406 W 19970617
- US 1997396 P 19960617
Abstract (en)
[origin: WO9749104A1] The present invention relates to making sensors by cutting wafers (20) from a boule or ingot of a metal oxide single crystal. Terminals (24, 26) are added to the wafer (20). The sensors produced are also described.
IPC 1-7
IPC 8 full level
H01C 7/04 (2006.01)
CPC (source: EP)
H01C 7/043 (2013.01)
Citation (search report)
- [A] EP 0723276 A2 19960724 - MURATA MANUFACTURING CO [JP]
- [A] US 4891158 A 19900102 - HATA TAKUOKI [JP]
- [A] PATENT ABSTRACTS OF JAPAN vol. 1995, no. 07 31 August 1995 (1995-08-31)
- See references of WO 9749104A1
Designated contracting state (EPC)
AT BE DE DK ES FI FR GB IE IT NL PT SE
DOCDB simple family (publication)
WO 9749104 A1 19971224; EP 0917717 A1 19990526; EP 0917717 A4 20001108
DOCDB simple family (application)
US 9710406 W 19970617; EP 97931199 A 19970617