Global Patent Index - EP 0917717 A4

EP 0917717 A4 2000-11-08 - SENSORS AND METHODS OF MAKING WAFER SENSORS

Title (en)

SENSORS AND METHODS OF MAKING WAFER SENSORS

Title (de)

SENSOREN UND VERFAHREN ZU DEREN HERSTELLUNG AUS EINEM GEMEINSAMEN WAFER

Title (fr)

CAPTEURS ET PROCEDES DE FABRICATION DE CAPTEURS EN PLAQUETTE

Publication

EP 0917717 A4 (EN)

Application

EP 97931199 A

Priority

  • US 9710406 W
  • US 1997396 P

Abstract (en)

[origin: WO9749104A1] The present invention relates to making sensors by cutting wafers (20) from a boule or ingot of a metal oxide single crystal. Terminals (24, 26) are added to the wafer (20). The sensors produced are also described.

IPC 1-7 (main, further and additional classification)

H01C 7/102; H01C 7/04; H01C 7/108

IPC 8 full level (invention and additional information)

H01C 7/04 (2006.01)

CPC (invention and additional information)

H01C 7/043 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE DE DK ES FI FR GB IE IT NL PT SE

EPO simple patent family

WO 9749104 A1 19971224; EP 0917717 A1 19990526; EP 0917717 A4 20001108

INPADOC legal status


2006-06-21 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20060102

2000-11-08 [A4] SUPPLEMENTARY SEARCH REPORT

- Effective date: 20000921

2000-11-08 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A4

- Designated State(s): AT BE DE DK ES FI FR GB IE IT NL PT SE

2000-07-26 [RIC1] CLASSIFICATION (CORRECTION)

- Free text: 7H 01C 7/102 A, 7H 01C 7/108 B, 7H 01C 7/04 B

1999-05-26 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19981209

1999-05-26 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE DE DK ES FI FR GB IE IT NL PT SE