EP 0918638 A1 19990602 - METHOD OF MAKING A LAMINATE COMPRISING A CONDUCTIVE POLYMER COMPOSITION
Title (en)
METHOD OF MAKING A LAMINATE COMPRISING A CONDUCTIVE POLYMER COMPOSITION
Title (de)
VERFAHREN ZUM HERSTELLEN VON LAMINATEN AUS LEITENDEN POLYMERZUSAMMENSETZUNGEN
Title (fr)
PROCEDE DE PRODUCTION D'UN STRATIFIE COMPRENANT UNE COMPOSITION POLYMERE CONDUCTRICE
Publication
Application
Priority
- US 9713419 W 19970730
- US 69175196 A 19960801
Abstract (en)
[origin: WO9805503A1] A method of making a laminate from a conductive polymer composition in which a particulate filler is dispersed in a polymeric component. The method comprises the following steps conducted sequentially in a single continuous procedure: (A) loading the polymeric component and the conductive filler into a mixing apparatus; (B) mixing the polymeric component and the conductive filler to form a molten mixture; (C) transporting the mixture from the mixing apparatus through a die; (D) forming a polymeric sheet; and (E) attaching metal foil to a least one side of the sheet to form a laminate. The laminate can be used to prepare circuit protection devices or heaters.
IPC 1-7
IPC 8 full level
B32B 37/00 (2006.01); B32B 15/08 (2006.01); B32B 27/20 (2006.01); B32B 37/15 (2006.01); B41D 7/00 (2006.01); B41K 1/02 (2006.01); B41K 1/04 (2006.01); H01C 7/02 (2006.01)
CPC (source: EP US)
B32B 15/08 (2013.01 - EP US); B32B 15/085 (2013.01 - US); B32B 27/20 (2013.01 - EP US); B32B 27/32 (2013.01 - US); B32B 37/153 (2013.01 - EP); B41D 7/00 (2013.01 - EP); B41K 1/02 (2013.01 - EP); H01C 7/027 (2013.01 - EP); B32B 2305/30 (2013.01 - EP); B32B 2307/202 (2013.01 - EP US); B32B 2307/704 (2013.01 - US); B32B 2457/00 (2013.01 - US)
Citation (search report)
See references of WO 9805503A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IT LI NL PT SE
DOCDB simple family (publication)
WO 9805503 A1 19980212; AU 3742997 A 19980225; CA 2261895 A1 19980212; CN 1090087 C 20020904; CN 1231635 A 19991013; CN 1326197 A 20011212; EP 0918638 A1 19990602; JP 2000515448 A 20001121; KR 20000029763 A 20000525; TW 343423 B 19981021
DOCDB simple family (application)
US 9713419 W 19970730; AU 3742997 A 19970730; CA 2261895 A 19970730; CN 01117188 A 20010421; CN 97198230 A 19970730; EP 97934350 A 19970730; JP 50804798 A 19970730; KR 19997000876 A 19990201; TW 86110731 A 19970728