EP 0926262 B1 20030326 - Process for selective deposition of a metal layer
Title (en)
Process for selective deposition of a metal layer
Title (de)
Verfahren zur selektiven Abscheidung einer Metallschicht
Title (fr)
Procédé de dépôt sélectif d' une couche métallique
Publication
Application
Priority
DE 19748888 A 19971105
Abstract (en)
[origin: DE19851101A1] Site selective coupling of multi-atom polar compound (I) to surface of a polymer substrate where regions of the surface are treated with electromagnetic radiation. Components in the base material of the polymer are converted to reactive centers and brought into contact with a liquid solution of the polar compound (I) to couple (I) to the reactive centers. An Independent claim is included for a process for the selective deposition of a metal layer onto the surface of a polymer substrate comprising: (A) irradiating the areas of the surface to be coated with electromagnetic radiation to produce reactive centers; (B) fixing the reactive functional groups on the surface with a noble metal compound by contact with a solution of one or more noble metal compounds (II); (C) depositing the metal layer in an electroless plating bath.
IPC 1-7
IPC 8 full level
C23C 18/16 (2006.01)
CPC (source: EP)
C23C 18/1605 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/30 (2013.01)
Designated contracting state (EPC)
DE FR
DOCDB simple family (publication)
DE 19851101 A1 19990506; DE 59807643 D1 20030430; EP 0926262 A1 19990630; EP 0926262 B1 20030326
DOCDB simple family (application)
DE 19851101 A 19981105; DE 59807643 T 19981105; EP 98121020 A 19981105