Global Patent Index - EP 0931323 B1

EP 0931323 B1 20000202 - MULTIWIRE PARALLEL CONDUCTOR FOR WINDINGS OF ELECTRICAL MACHINES AND APPLIANCES

Title (en)

MULTIWIRE PARALLEL CONDUCTOR FOR WINDINGS OF ELECTRICAL MACHINES AND APPLIANCES

Title (de)

MEHRFACHPARALLELLEITER FÜR WICKLUNGEN ELEKTRISCHER MASCHINEN UND GERÄTE

Title (fr)

CONDUCTEUR PARALLELE MULTIFILAIRE POUR ENROULEMENTS DE MACHINES ET D'APPAREILS ELECTRIQUES

Publication

EP 0931323 B1 20000202 (DE)

Application

EP 97942693 A 19970924

Priority

  • AT 9700208 W 19970924
  • AT 172796 A 19960930

Abstract (en)

[origin: WO9814964A1] The invention seeks to obtain a multiwire parallel conductor with properties meeting the required mechanical and electric criteria during and after winding and after hardening, and excluding with all certainty non oil impregnable gas inclusions in narrow sides and rim area. Enamel-insulated wire conductors (1) are coated with adhesive resin (2) on longitudinal contact surfaces and wrapped with paper insulation (3). The conductor bundle hardens afterwards. The adhesive area should represent approximately 80 % of the contact surface and the edge area must remain free of adhesive. In practice epoxy resins in a partially cross-linked state, so-called state B, have proved useful on account of their good winding properties, viscosity and shorter hardening times. Indicated design enables the conductor bundle to mechanically withstand the press-in process and associated shear strain after hardening of adhesive layers and does not impair the required electric strength of about 4.5kV/mm. The invention primarily guarantees that there will be no inclusions of air or gas bubbles which could otherwise lead to glow effects.

IPC 1-7

H01F 27/32; H01F 27/28

IPC 8 full level

H01F 27/28 (2006.01); H01F 27/32 (2006.01)

CPC (source: EP)

H01F 27/2823 (2013.01); H01F 27/323 (2013.01)

Designated contracting state (EPC)

AT CH DE FR GB IT LI NL SE

DOCDB simple family (publication)

WO 9814964 A1 19980409; AT E189555 T1 20000215; DE 59701100 D1 20000309; EP 0931323 A1 19990728; EP 0931323 B1 20000202

DOCDB simple family (application)

AT 9700208 W 19970924; AT 97942693 T 19970924; DE 59701100 T 19970924; EP 97942693 A 19970924