EP 0931974 A1 19990728 - Automatic lubricator for injection molding machine
Title (en)
Automatic lubricator for injection molding machine
Title (de)
Automatische Schmiervorrichtung für Spitzgiessmaschine
Title (fr)
Dipositif automatique de lubrification pour machine de moulage par injection
Publication
Application
Priority
- JP 2402598 A 19980122
- JP 16003398 A 19980526
Abstract (en)
An automatic lubricator for an injection molding machine, capable of performing proper lubrication in accordance with operation environment of the injection molding machine. A lubrication interval Ls is controlled according to length of cycle time S of the injection molding machine so that the lubrication interval Ls is increased when the cycle time S is long and it is decreased when the cycle time S is short. Further, when a ball screw temperature t1 is high the lubrication interval Ls is accordingly decreased by DELTA DL, and when the ball screw temperature t1 is low the lubrication interval Ls is accordingly increased by DELTA DL. Also, when the ambient temperature t2 is high the operation time Tp of a lubricating pump 2 is decreased, and when the ambient temperature t2 is low the operation time Tp is increased to stabilize the lubrication quantity.
IPC 1-7
IPC 8 full level
B29C 45/78 (2006.01); B29C 45/80 (2006.01); B29C 45/83 (2006.01); F16N 11/08 (2006.01); F16N 29/02 (2006.01); F16N 29/04 (2006.01)
CPC (source: EP US)
B29C 45/83 (2013.01 - EP US); F16N 11/08 (2013.01 - EP US); F16N 29/02 (2013.01 - EP US); F16N 29/04 (2013.01 - EP US)
Citation (search report)
- [A] EP 0439626 A1 19910807 - FANUC LTD [JP]
- [A] US 5297953 A 19940329 - WANG PO-LI [TW]
- [A] US 5182720 A 19930126 - BECK DAVID C [US], et al
- [A] EP 0303938 A2 19890222 - TAKANO CORP [JP]
- [A] EP 0612891 A1 19940831 - KOMATSU MFG CO LTD [JP]
- [A] PATENT ABSTRACTS OF JAPAN vol. 096, no. 012 26 December 1996 (1996-12-26)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0931974 A1 19990728; JP H11268093 A 19991005; US 6179597 B1 20010130
DOCDB simple family (application)
EP 99300471 A 19990122; JP 16003398 A 19980526; US 23628099 A 19990122