EP 0936966 A1 19990825 - APPARATUS FOR AND METHOD OF INJECTION MOLDING
Title (en)
APPARATUS FOR AND METHOD OF INJECTION MOLDING
Title (de)
GERÄT UND VERFAHREN ZUM SPRITZGIESSEN
Title (fr)
APPAREIL ET PROCEDE DE MOULAGE PAR INJECTION
Publication
Application
Priority
- CA 9700827 W 19971103
- US 74342896 A 19961101
Abstract (en)
[origin: WO9819846A1] An injection molding apparatus and method provides a mold injection nozzle (32) slidably mounted in a bore (28, 30) extending through a first mold half (16) and, optionally, a back plate. The mold nozzle (32) has a tip portion (50) providing a tip surface. In a second mold half (14), there is a corresponding, aligned bore, in which is located a plug (90). The plug (90) can be displaced by a plunger (88) but is separate from the plunger (88). In use, the plug (90) can be used to control the width of a gate between the plug (90) and the tip surface through which resin flows into the cavity. After molding, the plug (90) is displaced from its bore (72) into the bore (30) in the other mold half (16), both to close off the tip portion and to displace the plug (90) and tip portion away from the mold cavity (18). The mold is then opened with the plug (90) and the mold injection nozzle (32) being retained in the first mold half (16).
IPC 1-7
IPC 8 full level
B29C 45/26 (2006.01); B29C 45/28 (2006.01)
CPC (source: EP KR)
B29C 45/263 (2013.01 - EP); B29C 45/28 (2013.01 - KR); B29C 45/2896 (2013.01 - EP)
Citation (search report)
See references of WO 9819846A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9819846 A1 19980514; CA 2269230 A1 19980514; EP 0936966 A1 19990825; JP 2001503689 A 20010321; KR 20000053009 A 20000825; TW 353047 B 19990221
DOCDB simple family (application)
CA 9700827 W 19971103; CA 2269230 A 19971103; EP 97911092 A 19971103; JP 52090698 A 19971103; KR 19997003894 A 19990501; TW 86116352 A 19971104