EP 0939684 A1 19990908 - METHOD FOR SOFT SOLDERING METALS AND SOFT SOLDER FOR CARRYING SAID METHOD
Title (en)
METHOD FOR SOFT SOLDERING METALS AND SOFT SOLDER FOR CARRYING SAID METHOD
Title (de)
VERFAHREN ZUM WEICHLÖTEN VON METALLEN UND WEICHLOT ZUR AUSFÜHRUNG DIESES VERFAHRENS
Title (fr)
PROCEDE DE BRASAGE TENDRE DE METAUX ET METAL D'APPORT POUR BRASAGE TENDRE POUR METTRE LEDIT PROCEDE EN OEUVRE
Publication
Application
Priority
- DE 19728014 A 19970701
- EP 9803974 W 19980629
Abstract (en)
[origin: DE19728014A1] The invention relates a method for soft soldering metals onto a soldering joint, wherein a soft solder liquefied as a result of heating is brought into contact with the metal components to be joined on the solder joint and then cooled to produce a solid soldered joint. The invention is characterized in that at least one reaction component is provided on the soldering joint and reacts exothermally with at least one other component by heating it to a melting temperature so that the local temperature in the soldering joint rises to a solder-melting temperature.
IPC 1-7
IPC 8 full level
B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/34 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP)
B23K 1/0006 (2013.01); B23K 35/26 (2013.01); B23K 35/34 (2013.01); H05K 3/3485 (2020.08); B23K 2101/42 (2018.07); H05K 3/3494 (2013.01); H05K 2201/0272 (2013.01); H05K 2203/1163 (2013.01); H05K 2203/121 (2013.01); H05K 2203/125 (2013.01)
Citation (search report)
See references of WO 9901250A1
Designated contracting state (EPC)
BE DE DK ES FI FR GB IT LU NL SE
DOCDB simple family (publication)
DE 19728014 A1 19990107; EP 0939684 A1 19990908; WO 9901250 A1 19990114
DOCDB simple family (application)
DE 19728014 A 19970701; EP 9803974 W 19980629; EP 98939558 A 19980629