Global Patent Index - EP 0948811 A1

EP 0948811 A1 19991013 - MODULE WITH INTEGRATED CIRCUIT COMPRISING A SHAPING DEVICE

Title (en)

MODULE WITH INTEGRATED CIRCUIT COMPRISING A SHAPING DEVICE

Title (de)

EINE FORMUNGSEINRIICHTUNG ENTHALTENDER MODUL MIT INTEGRIERTER SCHALTUNG

Title (fr)

MODULE A CIRCUIT INTEGRE COMPORTANT UN ORGANE DE CONFORMATION

Publication

EP 0948811 A1 19991013 (FR)

Application

EP 97952993 A 19971223

Priority

  • FR 9702400 W 19971223
  • FR 9616205 A 19961230

Abstract (en)

[origin: FR2758005A1] The invention concerns a module with integrated circuit comprising an integrated circuit (2) arranged on one face of a insulating substrate film (1) and connected to conductive ranges (3) arranged on the opposite face of the substrate film (1) by linking elements (4) extending in holes (5) of the substrate film (1), and a shaping device (6) comprising a base (7) fixed in the substrate film (1) and a wall (8) inclining towards the inside of the shaping device (6).

IPC 1-7

H01L 23/31; H01L 23/24; G06K 19/077

IPC 8 full level

G06K 19/077 (2006.01); H01L 23/04 (2006.01); H01L 23/057 (2006.01); H01L 23/24 (2006.01)

CPC (source: EP)

G06K 19/07745 (2013.01); H01L 23/04 (2013.01); H01L 23/057 (2013.01); H01L 23/24 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/181 (2013.01)

Citation (search report)

See references of WO 9829906A1

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

FR 2758005 A1 19980703; FR 2758005 B1 19990507; EP 0948811 A1 19991013; WO 9829906 A1 19980709

DOCDB simple family (application)

FR 9616205 A 19961230; EP 97952993 A 19971223; FR 9702400 W 19971223