EP 0953208 A1 19991103 - DIAMOND BODY
Title (en)
DIAMOND BODY
Title (de)
DIAMANTKÖRPER
Title (fr)
CORPS DE DIAMANT
Publication
Application
Priority
- DE 9703004 W 19971220
- DE 19701680 A 19970118
Abstract (en)
[origin: DE19701680A1] The invention concerns a diamond body designed to enable the thermal contacting with at least one source of heat (30) and presenting at least one recess (13, 15) defining an angular position in relation to the mechanical tensions generated by said or any source of heat (30). Consequently, the mechanical tensions generated at various temperatures, either, for example, by various thermal expansion coefficients of the diamond body (12) or by the source of heat (30) featured by one semi-conductor component, are at least partly compensated, resulting in the possibility to take advantage of the exceptional thermoconductive capacity and insulating characteristics of the diamond, including diamond bodies (12) of a relatively big size.
IPC 1-7
IPC 8 full level
H01L 23/373 (2006.01)
CPC (source: EP US)
H01L 23/3732 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01S 5/0213 (2013.01 - EP US); H01S 5/024 (2013.01 - EP US); H01S 5/4025 (2013.01 - EP US)
Citation (search report)
See references of WO 9832171A1
Designated contracting state (EPC)
BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
DE 19701680 A1 19980723; DE 19701680 C2 20010802; EP 0953208 A1 19991103; JP 2001508600 A 20010626; US 6536509 B1 20030325; WO 9832171 A1 19980723
DOCDB simple family (application)
DE 19701680 A 19970118; DE 9703004 W 19971220; EP 97953665 A 19971220; JP 53328198 A 19971220; US 34150899 A 19990712