EP 0954879 A1 19991110 - ELECTRONIC COMPONENT
Title (en)
ELECTRONIC COMPONENT
Title (de)
ELEKTRONISCHES BAUELEMENT
Title (fr)
COMPOSANT ELECTRONIQUE
Publication
Application
Priority
DE 9700105 W 19970122
Abstract (en)
[origin: US6870245B1] The invention relates to an electronic component having an integrated circuit being packaged in a housing. The electronic component is adhesively bonded to an island of a leadframe, the island being designed to accommodate the integrated circuit and being dimensionally adapted to the base surface of the integrated circuit in order to minimize and prevent housing deformations.
IPC 1-7
IPC 8 full level
H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
H01L 23/3107 (2013.01 - EP US); H01L 23/49503 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US)
Citation (search report)
See references of WO 9832172A1
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
DOCDB simple family (application)
US 68846500 A 20001016; EP 97908115 A 19970122