Global Patent Index - EP 0956565 A1

EP 0956565 A1 19991117 - POLYMER COMPOSITION

Title (en)

POLYMER COMPOSITION

Title (de)

POLYMERZUSAMMENSETZUNG

Title (fr)

COMPOSITION POLYMERE

Publication

EP 0956565 A1 19991117 (EN)

Application

EP 98900952 A 19980123

Priority

  • GB 9800206 W 19980123
  • GB 9701577 A 19970125
  • GB 9704389 A 19970303
  • GB 9710844 A 19970528
  • GB 9717367 A 19970818
  • GB 9721401 A 19971010
  • GB 9722399 A 19971024

Abstract (en)

[origin: WO9833193A1] A polymer composition is elastically deformable from a quiescent state and comprises at least one electrically conductive filler dispersed within and encapsulated by a non-conductive elastomer, the nature and concentration of the filler being such that the electrical resistivity of the composition is variable in response to distorsion forces down to a value substantially equal to that of the conductor bridges of the filler, the composition further comprising a modifier which, on release of the distorsion forces, accelerates the elastic return of the composition to its quiescent state.

IPC 1-7

H01C 7/02; H01C 10/10; H01B 1/22

IPC 8 full level

C08L 83/04 (2006.01); H01B 1/22 (2006.01); H01C 7/02 (2006.01); H01C 10/10 (2006.01); G05G 9/047 (2006.01)

CPC (source: EP US)

H01C 7/027 (2013.01 - EP US); H01C 10/106 (2013.01 - EP US); G05G 2009/04729 (2013.01 - EP US); G05G 2009/04762 (2013.01 - EP US)

Citation (search report)

See references of WO 9833193A1

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI NL PT SE

DOCDB simple family (publication)

WO 9833193 A1 19980730; AT E370503 T1 20070915; AU 5674898 A 19980818; CA 2278246 A1 19980730; CA 2278246 C 20070403; CN 1248341 A 20000322; DE 69838245 D1 20070927; DE 69838245 T2 20080515; EP 0956565 A1 19991117; EP 0956565 B1 20070815; JP 2001509311 A 20010710; US 6291568 B1 20010918

DOCDB simple family (application)

GB 9800206 W 19980123; AT 98900952 T 19980123; AU 5674898 A 19980123; CA 2278246 A 19980123; CN 98802765 A 19980123; DE 69838245 T 19980123; EP 98900952 A 19980123; JP 53173298 A 19980123; US 35502899 A 19990722