EP 0961928 A4 20000426 - METHOD OF SCANNING SEMICONDUCTOR WAFERS TO INSPECT FOR DEFECTS
Title (en)
METHOD OF SCANNING SEMICONDUCTOR WAFERS TO INSPECT FOR DEFECTS
Title (de)
VERFAHREN ZUM SCANNEN VON HALBLEITERWAFERN ZUR DETEKTION VON DEFEKTEN
Title (fr)
PROCEDE SERVANT A DETECTER DES DEFAUTS PAR BALAYAGE SUR DES TRANCHES A SEMI-CONDUCTEURS
Publication
Application
Priority
- US 9803239 W 19980220
- US 3901797 P 19970221
Abstract (en)
[origin: WO9837404A1] A patterned semiconductor wafer (60) is centered on a vacuum chuck (20) that is capable of being rapidly rotated about an axis normal to the wafer (60) surface. The vacuum holds the wafer (60) flat to the chuck (20). As the chuck (20) is rotated, the wafer (60) rotates and the surface of the wafer (60) is scanned (10) with an optical head (30). The output is fed through a signal line (47) of the read head (30) and is compared to a reference file in a processor (50) or signal representing what a perfectly pattern wafer should look like. Differences between the reference standard and the patterned wafer (60) indicate flaws in the patterning. In the case of an unpatterned surface such as a wafer, glass substrate for a liquid crystal display, or a magnetic memory, the reference signal is a null signal and any signal from the read head (30) would signify a flaw in the unpatterned surface.
IPC 1-7
G01N 21/00; G01N 21/84; G01N 21/86; G01B 9/08; G01B 11/00; G01N 21/88; H01L 21/66
IPC 8 full level
G01B 11/30 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); H01L 21/66 (2006.01)
CPC (source: EP)
G01N 21/9501 (2013.01); G01N 21/95607 (2013.01)
Citation (search report)
- [XY] US 4505585 A 19850319 - YOSHIKAWA SHOJI [JP], et al
- [YA] US 4740079 A 19880426 - KOIZUMI MITSUYOSHI [JP], et al
- [Y] US 5135303 A 19920804 - UTO SACHIO [JP], et al
- [A] US 5225886 A 19930706 - KOIZUMI MITSUYOSHI [JP], et al
- [A] JP H08271438 A 19961018 - NEW KURIEISHIYON KK & US 5757479 A 19980526 - HAGA KAZUMI [JP], et al
- [Y] US 5402001 A 19950328 - HAGI TOSHIO [JP]
- [Y] JP H0830997 A 19960202 - YAMAHA CORP
- See references of WO 9837404A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9837404 A1 19980827; EP 0961928 A1 19991208; EP 0961928 A4 20000426; JP 2001512576 A 20010821
DOCDB simple family (application)
US 9803239 W 19980220; EP 98907527 A 19980220; JP 53687398 A 19980220