EP 0963289 A1 19991215 - PARTICLE BOARD WITH A HIGH DEGREE OF FLEXURAL RESISTANCE AND A HIGH BEND-ELASTICITY MODULUS
Title (en)
PARTICLE BOARD WITH A HIGH DEGREE OF FLEXURAL RESISTANCE AND A HIGH BEND-ELASTICITY MODULUS
Title (de)
HOLZSPANPLATTE MIT HOHER BIEGEFESTIGKEIT UND HOHEM BIEGE-E-MODUL
Title (fr)
PANNEAU DE PARTICULES A RESISTANCE ET COEFFICIENT D'ELASTICITE A LA FLEXION ELEVES
Publication
Application
Priority
- AT 9800305 W 19981215
- AT 214097 A 19971218
Abstract (en)
[origin: WO9932285A1] The invention relates to a particle board (1) with a high degree of flexural resistance and a high bend-elasticity modulus, consisting of one or more layers (2, 3, 5, 6) of wood chips, said wood chips having been impregnated with condensation resins and compacted under pressure, at a high temperature. The size of the chips may vary. According to the invention, a woven, bonded or non-woven fabric (5) consisting of natural fibres is arranged inside or between the individual layers of glued wood chips.
IPC 1-7
IPC 8 full level
B27N 3/06 (2006.01); B32B 9/02 (2006.01); B32B 21/10 (2006.01)
CPC (source: EP)
B27N 3/06 (2013.01); B32B 9/02 (2013.01); B32B 21/10 (2013.01)
Citation (search report)
See references of WO 9932285A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI NL PT SE
DOCDB simple family (publication)
WO 9932285 A1 19990701; AT 407507 B 20010425; AT A214097 A 20000815; CZ 272899 A3 19991117; EP 0963289 A1 19991215; HU P0000820 A2 20000828; HU P0000820 A3 20000928; PL 335191 A1 20000410; SK 109499 A3 20000118
DOCDB simple family (application)
AT 9800305 W 19981215; AT 214097 A 19971218; CZ 272899 A 19981215; EP 98960848 A 19981215; HU P0000820 A 19981215; PL 33519198 A 19981215; SK 109499 A 19981215