EP 0968632 A2 20000105 - DEVICE FOR DISSIPATING HEAT FROM A HEAT SOURCE LOCATED IN A HOUSING
Title (en)
DEVICE FOR DISSIPATING HEAT FROM A HEAT SOURCE LOCATED IN A HOUSING
Title (de)
ANORDNUNG ZUR ABFÜHRUNG VON WÄRME EINER IN EINEM GEHÄUSE ANGEORDNETEN WÄRMEQUELLE
Title (fr)
DISPOSITIF SERVANT A DISSIPER LA CHALEUR PROVENANT D'UNE SOURCE DE CHALEUR PLACEE DANS UN BOITIER
Publication
Application
Priority
- DE 9800670 W 19980306
- DE 29704885 U 19970319
Abstract (en)
[origin: WO9842169A2] According to the invention, the device has a primary cooling element (K1) located inside a housing (G) and a secondary cooling element (K2) located outside the housing (G). The cooling elements are connected via a heat conduction element (P), in order to dissipate heat from the housing (G), said connection being heat-conductive and mechanically moveable. The inventive device for dissipating heat has the particular advantage of drastically reducing the risk of hairline cracks forming in the heat conduction element (P) as a result of vibrations, and could therefore be used effectively in an industrial environment.
IPC 1-7
IPC 8 full level
G06F 1/20 (2006.01); H01L 23/427 (2006.01)
CPC (source: EP)
F28D 15/0275 (2013.01); G06F 1/20 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 9842169A2
Designated contracting state (EPC)
AT BE CH DE ES FR GB IT LI NL
DOCDB simple family (publication)
DE 29704885 U1 19980430; EP 0968632 A2 20000105; WO 9842169 A2 19980924; WO 9842169 A3 19990225
DOCDB simple family (application)
DE 29704885 U 19970319; DE 9800670 W 19980306; EP 98919048 A 19980306