EP 0970261 A1 20000112 - MAGNESIUM OXIDE SPUTTERING APPARATUS
Title (en)
MAGNESIUM OXIDE SPUTTERING APPARATUS
Title (de)
VORRICHTUNG ZUM SPUTTERN DES MAGNESIUMOXYDS
Title (fr)
APPAREIL DE PULVERISATION CATHODIQUE D'OXYDE DE MAGNESIUM
Publication
Application
Priority
- US 9805143 W 19980317
- US 82331897 A 19970321
Abstract (en)
[origin: WO9842890A1] This invention relates to a method and apparatus for high rate reactive sputtering. Particularly, the invention relates to a method and apparatus of sputter depositing reacted metal-compound films where the sputter deposition rate approaches the deposition rate of the unreacted metal. More particularly, the invention relates to an apparatus wherein the sputter deposition target is placed at a greater than usual distance from the substrate and the target metallic erosion track is confined to a narrower width than is typical in current systems.
IPC 1-7
IPC 8 full level
C23C 14/00 (2006.01); C23C 14/08 (2006.01); C23C 14/22 (2006.01); C23C 14/35 (2006.01); H01J 37/34 (2006.01)
CPC (source: EP KR)
C23C 14/0036 (2013.01 - EP); C23C 14/081 (2013.01 - EP); C23C 14/225 (2013.01 - EP); C23C 14/3492 (2013.01 - KR); C23C 14/35 (2013.01 - EP); C23C 14/352 (2013.01 - KR); C23C 14/548 (2013.01 - KR); H01J 37/3405 (2013.01 - EP)
Citation (search report)
See references of WO 9842890A1
Designated contracting state (EPC)
CH DE FR LI
DOCDB simple family (publication)
WO 9842890 A1 19981001; AU 6761598 A 19981020; EP 0970261 A1 20000112; JP 2001516398 A 20010925; KR 20010005515 A 20010115
DOCDB simple family (application)
US 9805143 W 19980317; AU 6761598 A 19980317; EP 98912942 A 19980317; JP 53993198 A 19980317; KR 19997008573 A 19990920