EP 0970437 A1 20000112 - ELECTRONIC MODULE FOR CHIP CARD
Title (en)
ELECTRONIC MODULE FOR CHIP CARD
Title (de)
ELEKTRONISCHES MODUL FÜR EINE CHIPKARTE
Title (fr)
MODULE ELECTRONIQUE POUR CARTE A PUCE
Publication
Application
Priority
- FR 9800500 W 19980309
- FR 9704094 A 19970327
Abstract (en)
[origin: FR2761498A1] The invention concerns an electronic module, in particular designed to be fixed in an electronic device in the form of a card, comprising a medium (40) including at least a surface (44) provided with contact pads (46; 48; 50) and a microcircuit (56) which is fixed on said medium (40) and which comprises exit hubs (60, 62) each connected to a medium contact pad. The invention is characterised in that the connections (66, 68) between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance matching the relief of the medium. Advantageously, the conductive substance is a conductive isotropic adhesive.
IPC 1-7
IPC 8 full level
B42D 15/10 (2006.01); G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP US)
G06K 19/07743 (2013.01 - EP US); H01L 23/49855 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/25 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 2224/24011 (2013.01 - EP US); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24105 (2013.01 - EP US); H01L 2224/24146 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/25175 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48228 (2013.01 - EP US); H01L 2224/484 (2013.01 - EP US); H01L 2224/48599 (2013.01 - EP US); H01L 2224/48699 (2013.01 - EP US); H01L 2224/73215 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/76152 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 9844451A1
Designated contracting state (EPC)
BE CH DE DK ES FI FR GB GR IT LI LU NL PT SE
DOCDB simple family (publication)
FR 2761498 A1 19981002; FR 2761498 B1 19990618; AU 6922598 A 19981022; AU 720691 B2 20000608; BR 9808062 A 20000308; CA 2283692 A1 19981008; CN 1183486 C 20050105; CN 1257599 A 20000621; DE 69832104 D1 20051201; DE 69832104 T2 20061123; EP 0970437 A1 20000112; EP 1168240 A2 20020102; EP 1168240 A3 20020130; EP 1168240 B1 20051026; HK 1028833 A1 20010302; JP 2002511188 A 20020409; JP 3869860 B2 20070117; RU 2200975 C2 20030320; US 2002125329 A1 20020912; US 6435414 B1 20020820; US 6769619 B2 20040803; WO 9844451 A1 19981008
DOCDB simple family (application)
FR 9704094 A 19970327; AU 6922598 A 19980309; BR 9808062 A 19980309; CA 2283692 A 19980309; CN 98805448 A 19980309; DE 69832104 T 19980309; EP 01117497 A 19980309; EP 98914903 A 19980309; FR 9800500 W 19980309; HK 00108190 A 20001219; JP 54121098 A 19980309; RU 99122604 A 19980309; US 14118002 A 20020509; US 40200899 A 19991122