Global Patent Index - EP 0970437 A1

EP 0970437 A1 20000112 - ELECTRONIC MODULE FOR CHIP CARD

Title (en)

ELECTRONIC MODULE FOR CHIP CARD

Title (de)

ELEKTRONISCHES MODUL FÜR EINE CHIPKARTE

Title (fr)

MODULE ELECTRONIQUE POUR CARTE A PUCE

Publication

EP 0970437 A1 (FR)

Application

EP 98914903 A

Priority

  • FR 9800500 W
  • FR 9704094 A

Abstract (en)

[origin: FR2761498A1] The invention concerns an electronic module, in particular designed to be fixed in an electronic device in the form of a card, comprising a medium (40) including at least a surface (44) provided with contact pads (46; 48; 50) and a microcircuit (56) which is fixed on said medium (40) and which comprises exit hubs (60, 62) each connected to a medium contact pad. The invention is characterised in that the connections (66, 68) between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance matching the relief of the medium. Advantageously, the conductive substance is a conductive isotropic adhesive.

IPC 1-7

G06K 19/077

IPC 8 full level

B42D 15/10 (2006.01); G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01)

CPC (source: EP)

G06K 19/07743 (2013.01); H01L 23/49855 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 24/45 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/76152 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)

C-Set (source: EP)

  1. H01L 2224/484 + H01L 2924/00014
  2. H01L 2224/48091 + H01L 2924/00014
  3. H01L 2224/45124 + H01L 2924/00014
  4. H01L 2224/45144 + H01L 2924/00014
  5. H01L 2224/73267 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  6. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  7. H01L 2224/73267 + H01L 2224/32225 + H01L 2224/24226 + H01L 2924/00
  8. H01L 2924/07802 + H01L 2924/00
  9. H01L 2924/181 + H01L 2924/00012
  10. H01L 2924/00014 + H01L 2224/85399
  11. H01L 2924/00014 + H01L 2224/05599

 

Citation (search report)

See references of WO 9844451A1

Designated contracting state (EPC)

BE CH DE DK ES FI FR GB GR IT LI LU NL PT SE

DOCDB simple family (publication)

FR 2761498 A1 19981002; FR 2761498 B1 19990618; AU 6922598 A 19981022; AU 720691 B2 20000608; BR 9808062 A 20000308; CA 2283692 A1 19981008; CN 1183486 C 20050105; CN 1257599 A 20000621; DE 69832104 D1 20051201; DE 69832104 T2 20061123; EP 0970437 A1 20000112; EP 1168240 A2 20020102; EP 1168240 A3 20020130; EP 1168240 B1 20051026; HK 1028833 A1 20050722; JP 2002511188 A 20020409; JP 3869860 B2 20070117; RU 2200975 C2 20030320; US 2002125329 A1 20020912; US 6435414 B1 20020820; US 6769619 B2 20040803; WO 9844451 A1 19981008

DOCDB simple family (application)

FR 9704094 A 19970327; AU 6922598 A 19980309; BR 9808062 A 19980309; CA 2283692 A 19980309; CN 98805448 A 19980309; DE 69832104 T 19980309; EP 01117497 A 19980309; EP 98914903 A 19980309; FR 9800500 W 19980309; HK 00108190 A 20001219; JP 54121098 A 19980309; RU 99122604 A 19980309; US 14118002 A 20020509; US 40200899 A 19991122