Global Patent Index - EP 0970437 A1

EP 0970437 A1 2000-01-12 - ELECTRONIC MODULE FOR CHIP CARD

Title (en)

ELECTRONIC MODULE FOR CHIP CARD

Title (de)

ELEKTRONISCHES MODUL FÜR EINE CHIPKARTE

Title (fr)

MODULE ELECTRONIQUE POUR CARTE A PUCE

Publication

EP 0970437 A1 (FR)

Application

EP 98914903 A

Priority

  • FR 9800500 W
  • FR 9704094 A

Abstract (en)

[origin: FR2761498A1] The invention concerns an electronic module, in particular designed to be fixed in an electronic device in the form of a card, comprising a medium (40) including at least a surface (44) provided with contact pads (46; 48; 50) and a microcircuit (56) which is fixed on said medium (40) and which comprises exit hubs (60, 62) each connected to a medium contact pad. The invention is characterised in that the connections (66, 68) between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance matching the relief of the medium. Advantageously, the conductive substance is a conductive isotropic adhesive.

IPC 1-7 (main, further and additional classification)

G06K 19/077

IPC 8 full level (invention and additional information)

B42D 15/10 (2006.01); G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01)

CPC (invention and additional information)

H01L 24/25 (2013.01); G06K 19/07743 (2013.01); H01L 23/49855 (2013.01); H01L 24/24 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 24/45 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/76152 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)

Combination set (CPC)

  1. H01L 2224/484 + H01L 2924/00014
  2. H01L 2224/48091 + H01L 2924/00014
  3. H01L 2224/45124 + H01L 2924/00014
  4. H01L 2224/45144 + H01L 2924/00014
  5. H01L 2224/73267 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  6. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  7. H01L 2224/73267 + H01L 2224/32225 + H01L 2224/24226 + H01L 2924/00
  8. H01L 2924/07802 + H01L 2924/00
  9. H01L 2924/181 + H01L 2924/00012
  10. H01L 2924/00014 + H01L 2224/85399
  11. H01L 2924/00014 + H01L 2224/05599

Designated contracting state (EPC)

BE CH DE DK ES FI FR GB GR IT LI LU NL PT SE

EPO simple patent family

FR 2761498 A1 19981002; FR 2761498 B1 19990618; AU 6922598 A 19981022; AU 720691 B2 20000608; BR 9808062 A 20000308; CA 2283692 A1 19981008; CN 1183486 C 20050105; CN 1257599 A 20000621; DE 69832104 D1 20051201; DE 69832104 T2 20061123; EP 0970437 A1 20000112; EP 1168240 A2 20020102; EP 1168240 A3 20020130; EP 1168240 B1 20051026; HK 1028833 A1 20050722; JP 2002511188 A 20020409; JP 3869860 B2 20070117; RU 2200975 C2 20030320; US 2002125329 A1 20020912; US 6435414 B1 20020820; US 6769619 B2 20040803; WO 9844451 A1 19981008

INPADOC legal status


2003-12-10 [18R] REFUSED

- Effective date: 20030219

2001-03-21 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20010208

2000-01-12 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19991027

2000-01-12 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): BE CH DE DK ES FI FR GB GR IT LI LU NL PT SE