EP 0970520 A2 20000112 - MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES
Title (en)
MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES
Title (de)
MONTAGE-STRUKTUR UND MONTAGE-VERFAHREN FÜR HALBLEITERANORDNUNG
Title (fr)
STRUCTURE DE MONTAGE ET PROCEDE DE MONTAGE POUR DISPOSITIFS SEMI-CONDUCTEURS
Publication
Application
Priority
- JP 657597 A 19970117
- US 9800856 W 19980116
Abstract (en)
[origin: WO9832159A2] The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be securely fixed to a circuit board by short-time heat curing, which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.
IPC 1-7
IPC 8 full level
C08G 59/24 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR)
H01L 21/00 (2013.01 - KR); H01L 21/563 (2013.01 - EP); H01L 23/293 (2013.01 - EP); H05K 3/284 (2013.01 - EP); H05K 3/3436 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/07811 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H05K 2201/10977 (2013.01 - EP); H05K 2203/176 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9832159 A2 19980723; WO 9832159 A3 19990218; BR 9806742 A 20000606; CA 2278006 A1 19980723; CN 1112723 C 20030625; CN 1243601 A 20000202; EP 0970520 A2 20000112; EP 0970520 A4 20000830; ID 22705 A 19991209; JP 3543902 B2 20040721; JP H10209342 A 19980807; KR 100563158 B1 20060322; KR 20000070227 A 20001125; TW 396469 B 20000701
DOCDB simple family (application)
US 9800856 W 19980116; BR 9806742 A 19980116; CA 2278006 A 19980116; CN 98801883 A 19980116; EP 98902589 A 19980116; ID 990702 A 19980116; JP 657597 A 19970117; KR 19997006453 A 19990715; TW 87100681 A 19980117