Global Patent Index - EP 0970520 A2

EP 0970520 A2 2000-01-12 - MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES

Title (en)

MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES

Title (de)

MONTAGE-STRUKTUR UND MONTAGE-VERFAHREN FÜR HALBLEITERANORDNUNG

Title (fr)

STRUCTURE DE MONTAGE ET PROCEDE DE MONTAGE POUR DISPOSITIFS SEMI-CONDUCTEURS

Publication

EP 0970520 A2 (EN)

Application

EP 98902589 A

Priority

  • JP 657597 A
  • US 9800856 W

Abstract (en)

[origin: WO9832159A2] The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be securely fixed to a circuit board by short-time heat curing, which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.

IPC 1-7

H01L 23/00

IPC 8 full level

C08G 59/24 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01)

CPC

H01L 21/563 (2013.01); H01L 23/293 (2013.01); H05K 3/284 (2013.01); H05K 3/3436 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/176 (2013.01); Y02P 70/613 (2015.11)

C-Set

  1. H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  2. H01L 2924/15311 + H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  3. H01L 2924/07811 + H01L 2924/00

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family

WO 9832159 A2 19980723; WO 9832159 A3 19990218; BR 9806742 A 20000606; CA 2278006 A1 19980723; CN 1112723 C 20030625; CN 1243601 A 20000202; EP 0970520 A2 20000112; EP 0970520 A4 20000830; ID 22705 A 19991209; JP 3543902 B2 20040721; JP H10209342 A 19980807; KR 100563158 B1 20060322; KR 20000070227 A 20001125; TW 396469 B 20000701