Global Patent Index - EP 0970522 A1

EP 0970522 A1 20000112 - BGA CONNECTOR WITH HEAT ACTIVATED CONNECTION AND DISCONNECTION MEANS

Title (en)

BGA CONNECTOR WITH HEAT ACTIVATED CONNECTION AND DISCONNECTION MEANS

Title (de)

BGA-VERBINDER MIT WÄRMEAKTIVIERTEN MITTELN ZUM VERBINDEN UND LÖSEN

Title (fr)

CONNECTEUR BGA MUNI DE MOYENS DE CONNEXION ET DE DECONNEXION ACTIVES A CHAUD

Publication

EP 0970522 A1 20000112 (EN)

Application

EP 98964132 A 19981218

Priority

  • JP 36512597 A 19971219
  • US 9827066 W 19981218

Abstract (en)

[origin: WO9933109A1] An improved connector assembly (1) particularly useful for testing semiconductor devices of ball grid array ("BGA") structure (10) with a plurality of solder balls (11) formed on the surface thereof. The balls (11) are placed into contact with opposing conductive portions (3a) of the connector assembly. A heat generating member (7), such as a wire, is disposed proximate to the connector assembly conductive portions (3a) and may be selectively energized to generate heat to partially melt the solder balls (11). Reliable connections are effected in this manner.

IPC 1-7

H01L 23/498; H05K 3/34

IPC 8 full level

H01L 23/32 (2006.01); H01L 23/498 (2006.01); H01R 4/02 (2006.01); H01R 12/04 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01)

CPC (source: EP)

H01L 23/49827 (2013.01); H05K 1/0212 (2013.01); H05K 3/3436 (2013.01); G01R 1/07307 (2013.01); G01R 31/2886 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3011 (2013.01); H05K 1/141 (2013.01); H05K 1/167 (2013.01); H05K 3/3494 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/0949 (2013.01); H05K 2201/09772 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/1115 (2013.01); H05K 2203/162 (2013.01); Y02P 70/50 (2015.11)

Citation (search report)

See references of WO 9933109A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 9933109 A1 19990701; CN 1252894 A 20000510; EP 0970522 A1 20000112; JP H11204173 A 19990730

DOCDB simple family (application)

US 9827066 W 19981218; CN 98804211 A 19981218; EP 98964132 A 19981218; JP 36512597 A 19971219