EP 0971571 A3 20010808 - Process for manufacturing a multilayer
Title (en)
Process for manufacturing a multilayer
Title (de)
Verfahren zur Herstellung eines Multilayers
Title (fr)
Procédé de fabrication d'une plaque multicouche
Publication
Application
Priority
DE 19830628 A 19980709
Abstract (en)
[origin: EP0971571A2] The method involves applying a localized high temperature to fix at least two inner layers (10), which are separated by an insulating adhesive layer (14), at discrete points within a multilayer circuit board (11), with the inner layers pressed together during application of the localized high temperature, e.g. using heating pins (36).
IPC 1-7
IPC 8 full level
H05K 3/46 (2006.01)
CPC (source: EP)
H05K 3/4638 (2013.01); H05K 2203/065 (2013.01)
Citation (search report)
- [A] DE 4029970 A1 19920402 - SIEMENS NIXDORF INF SYST [DE]
- [A] EP 0800337 A1 19971008 - SO MA CI S S P A [IT]
- [A] PATENT ABSTRACTS OF JAPAN vol. 014, no. 557 (E - 1011) 11 December 1990 (1990-12-11)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0971571 A2 20000112; EP 0971571 A3 20010808; DE 19830628 C1 20000420
DOCDB simple family (application)
EP 99112236 A 19990625; DE 19830628 A 19980709