EP 0973176 A1 20000119 - Nickel barrier end termination and method
Title (en)
Nickel barrier end termination and method
Title (de)
Anschlusskontakt mit Nickelbarriere und Verfahren
Title (fr)
Contact de connexion avec barrière de nickel et méthode
Publication
Application
Priority
- EP 98305676 A 19980716
- US 88585997 A 19970630
Abstract (en)
A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal region and thereafter provided with a final tin or tin-lead termination. <IMAGE>
IPC 1-7
IPC 8 full level
C23C 18/32 (2006.01); C25D 3/12 (2006.01); C25D 5/02 (2006.01); H01C 1/142 (2006.01); H01C 7/10 (2006.01); H01C 7/112 (2006.01); H01C 7/18 (2006.01); H01C 17/06 (2006.01); H01C 17/28 (2006.01)
CPC (source: EP)
H01C 1/142 (2013.01); H01C 7/112 (2013.01); H01C 7/18 (2013.01); H01C 17/28 (2013.01)
Citation (search report)
- [A] EP 0092971 A1 19831102 - RICHARDSON CHEMICAL CO [US], et al
- [A] EP 0716429 A2 19960612 - HARRIS CORP [US]
- [A] DE 19634488 A1 19980305 - SIEMENS MATSUSHITA COMPONENTS [DE]
- [XY] PATENT ABSTRACTS OF JAPAN vol. 098, no. 011 30 September 1998 (1998-09-30)
- [Y] PATENT ABSTRACTS OF JAPAN vol. 006, no. 194 (E - 134) 2 October 1982 (1982-10-02)
- [A] PATENT ABSTRACTS OF JAPAN vol. 098, no. 001 30 January 1998 (1998-01-30)
Designated contracting state (EPC)
AT DE FR IE IT
DOCDB simple family (publication)
GB 2326976 A 19990106; GB 9813796 D0 19980826; EP 0973176 A1 20000119; JP H11106938 A 19990420
DOCDB simple family (application)
GB 9813796 A 19980625; EP 98305676 A 19980716; JP 18499398 A 19980630