EP 0975826 A2 20000202 - METHOD FOR ELECTROPLATING METALLIC AND NON-METALLIC ENDLESS PRODUCTS AND DEVICE FOR CARRYING OUT SAID METHOD
Title (en)
METHOD FOR ELECTROPLATING METALLIC AND NON-METALLIC ENDLESS PRODUCTS AND DEVICE FOR CARRYING OUT SAID METHOD
Title (de)
VERFAHREN ZUM ELEKTROLYTISCHEN BESCHICHTEN VON METALLISCHEN ODER NICHTMETALLISCHEN ENDLOSPRODUKTEN UND VORRICHTUNG ZUR DURCHFÜHRUNG DES VERFAHRENS
Title (fr)
PROCEDE DE REVETEMENT ELECTROLYTIQUE DE PRODUITS CONTINUS METALLIQUES OU NON METALLIQUES ET DISPOSITIF POUR LA MISE EN OEUVRE DE CE PROCEDE
Publication
Application
Priority
- DE 19716493 A 19970419
- EP 9802196 W 19980415
Abstract (en)
[origin: DE19716493A1] The invention relates to a method for electroplating metallic and non-metallic endless products with metals or alloys by means of a continuous process using aprotic electrolytes free of water and oxygen. Said method is characterized in that the endless product is directed via a lock system (1) into a shielded electroplating installation placed under an inert-gas atmosphere, where the following steps are carried out at temperatures </=120 DEG C: activating the endless product to be electroplated; rinsing the endless product to be electroplated; contacting the endless product to be electroplated; electroplating the endless product to be electroplated with metal or a metal alloy; drying the electroplated endless product; and delivering the electroplated endless product from the installation via a lock system. The invention also relates to a device for carrying out this method.
IPC 1-7
IPC 8 full level
CPC (source: EP US)
C25D 3/44 (2013.01 - EP US); C25D 7/0607 (2013.01 - EP US); C25D 7/0621 (2013.01 - EP US)
Citation (search report)
See references of WO 9848081A2
Designated contracting state (EPC)
AT BE DE DK ES FI FR GB IT LU NL SE
DOCDB simple family (publication)
DE 19716493 A1 19981022; DE 19716493 C2 20011129; AT 220130 T 20020715; AU 7525798 A 19981113; CA 2287179 A1 19981029; CA 2287179 C 20031118; DE 59804675 D1 20020808; EP 0975826 A2 20000202; EP 0975826 B1 20020703; JP 2001521581 A 20011106; JP 4411397 B2 20100210; US 6340422 B1 20020122; WO 9848081 A2 19981029; WO 9848081 A3 19990211; ZA 983275 B 19981104
DOCDB simple family (application)
DE 19716493 A 19970419; AT 98922715 T 19980415; AU 7525798 A 19980415; CA 2287179 A 19980415; DE 59804675 T 19980415; EP 9802196 W 19980415; EP 98922715 A 19980415; JP 54495798 A 19980415; US 40343099 A 19991101; ZA 983275 A 19980420