Global Patent Index - EP 0975826 A2

EP 0975826 A2 20000202 - METHOD FOR ELECTROPLATING METALLIC AND NON-METALLIC ENDLESS PRODUCTS AND DEVICE FOR CARRYING OUT SAID METHOD

Title (en)

METHOD FOR ELECTROPLATING METALLIC AND NON-METALLIC ENDLESS PRODUCTS AND DEVICE FOR CARRYING OUT SAID METHOD

Title (de)

VERFAHREN ZUM ELEKTROLYTISCHEN BESCHICHTEN VON METALLISCHEN ODER NICHTMETALLISCHEN ENDLOSPRODUKTEN UND VORRICHTUNG ZUR DURCHFÜHRUNG DES VERFAHRENS

Title (fr)

PROCEDE DE REVETEMENT ELECTROLYTIQUE DE PRODUITS CONTINUS METALLIQUES OU NON METALLIQUES ET DISPOSITIF POUR LA MISE EN OEUVRE DE CE PROCEDE

Publication

EP 0975826 A2 20000202 (DE)

Application

EP 98922715 A 19980415

Priority

  • DE 19716493 A 19970419
  • EP 9802196 W 19980415

Abstract (en)

[origin: US6340422B1] The present invention is directed to processes and devices for performing the processes comprising electroplating one or more metallic or non-metallic continuous products with metals or metal alloys in a continuous process from aprotic electrolytes free of water and oxygen, wherein the continuous product is passed through a lock system (1) into an encapsulated coating plant under inert gas atmosphere, and the following steps are performed at temperatures <=120° C.:activating the continuous product to be coated;rinsing the continuous product to be coated;contacting the continuous product to be coated;electroplating the continuous product to be coated using a metal or metal alloy;drying the coated continuous product;discharge of the coated continuous product from the plant through a lock system.

IPC 1-7

C25D 7/06; C25D 3/44

IPC 8 full level

C25D 3/44 (2006.01); C25D 7/06 (2006.01)

CPC (source: EP US)

C25D 3/44 (2013.01 - EP US); C25D 7/0607 (2013.01 - EP US); C25D 7/0621 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE DE DK ES FI FR GB IT LU NL SE

DOCDB simple family (publication)

US 6340422 B1 20020122; AT E220130 T1 20020715; AU 7525798 A 19981113; CA 2287179 A1 19981029; CA 2287179 C 20031118; DE 19716493 A1 19981022; DE 19716493 C2 20011129; DE 59804675 D1 20020808; EP 0975826 A2 20000202; EP 0975826 B1 20020703; JP 2001521581 A 20011106; JP 4411397 B2 20100210; WO 9848081 A2 19981029; WO 9848081 A3 19990211; ZA 983275 B 19981104

DOCDB simple family (application)

US 40343099 A 19991101; AT 98922715 T 19980415; AU 7525798 A 19980415; CA 2287179 A 19980415; DE 19716493 A 19970419; DE 59804675 T 19980415; EP 9802196 W 19980415; EP 98922715 A 19980415; JP 54495798 A 19980415; ZA 983275 A 19980420