EP 0978140 A1 20000209 - METHOD FOR ETCHING SILICON WAFER
Title (en)
METHOD FOR ETCHING SILICON WAFER
Title (de)
ÄTZVERFAHREN FÜR EINE SILIZIUM-SCHEIBE
Title (fr)
PROCEDE D'ATTAQUE DE PLAQUETTE EN SILICIUM
Publication
Application
Priority
- JP 11455697 A 19970502
- US 9808936 W 19980501
- US 7068098 A 19980430
Abstract (en)
[origin: WO9850948A1] A method for etching a silicon wafer includes the steps of: lapping a silicon wafer; etching the silicon wafer; and polishing the silicon wafer; wherein the etching step includes an etching treatment and a rinsing treatment, and at least an oxidizing agent is added to a rinse to be used for the rinsing treatment, thereby forming an oxidation film on a surface of the silicon wafer.
IPC 1-7
IPC 8 full level
H01L 21/306 (2006.01)
CPC (source: EP)
H01L 21/02052 (2013.01)
Citation (search report)
See references of WO 9850948A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9850948 A1 19981112; CN 1254440 A 20000524; EP 0978140 A1 20000209
DOCDB simple family (application)
US 9808936 W 19980501; CN 98804760 A 19980501; EP 98920143 A 19980501