EP 0978572 A1 20000209 - Gold base alloy for jewellery
Title (en)
Gold base alloy for jewellery
Title (de)
Goldlegierung für Schmuckzwecke
Title (fr)
Alliage d'or pour la bijouterie
Publication
Application
Priority
DE 19834858 A 19980801
Abstract (en)
Gold alloy used for jewelry contains 70-80 % gold, 15-25 % copper and 0.1-0.5 % gallium.
Abstract (de)
Eine Goldlegierung für Schmuckzwecke enthält 70 bis 80 % Gold und 15 bis 25 % Kupfer. Die Legierung ist dadurch gekennzeichnet, daß sie 0,1 bis 5 % Gallium enthält.
IPC 1-7
IPC 8 full level
A44C 27/00 (2006.01); C22C 5/02 (2006.01)
CPC (source: EP)
C22C 5/02 (2013.01)
Citation (search report)
- [X] US 5338378 A 19940816 - OHTA MICHIO [JP], et al
- [A] US 3861455 A 19750121 - INGERSOLL CLYDE E
- [X] CHEMICAL ABSTRACTS, vol. 123, no. 12, 18 September 1995, Columbus, Ohio, US; abstract no. 150335, OUCHIDA, R. ET AL: "Effects of Au/Cu ratio and gallium content on the low-temperature age-hardening in Au-Cu-Ga alloys" XP002121973 & J. MATER. SCI. (1995), 30(15), 3863-6, XP002123010
- [X] CHEMICAL ABSTRACTS, vol. 123, no. 12, 18 September 1995, Columbus, Ohio, US; abstract no. 152835, WATANABE, IKUYA ET AL: "Dimensional changes related to ordering in an gold-copper-3% gallium allo at intraoral temperature" XP002121974 & DENT. MATER. (1994), 10(6), 369-74, XP002123011
- [A] PATENT ABSTRACTS OF JAPAN vol. 013, no. 258 (M - 838) 15 June 1989 (1989-06-15)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0978572 A1 20000209; DE 19834858 A1 20000210; DE 19834858 C2 20030102
DOCDB simple family (application)
EP 99109579 A 19990514; DE 19834858 A 19980801