Global Patent Index - EP 0978871 A3

EP 0978871 A3 2001-12-19 - A low power packaging design

Title (en)

A low power packaging design

Title (de)

Ein Packungsentwurf für eine Anordnung niedriger Leistung

Title (fr)

Un modèle d'empaquetage pour un dispositif à basse puissance

Publication

EP 0978871 A3 (EN)

Application

EP 99114184 A

Priority

US 12932198 A

Abstract (en)

[origin: EP0978871A2] A connector 20 has a strap 21 for a drain contact formed in a conventional sheet of leadframe metal. The sheet is punched and formed to a fashion bent edge tab contacts 22, 24 with a surface for mounting the power MOSFET. The bent edge tab contains 22, 24 bring the drain electrical current from the backside of a mounted device to the plane comprising the top side of the device 90. <IMAGE>

IPC 1-7 (main, further and additional classification)

H01L 21/60; H01L 23/04

IPC 8 full level (invention and additional information)

H01L 21/60 (2006.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 29/41 (2006.01); H01L 29/78 (2006.01)

CPC (invention and additional information)

H01L 24/81 (2013.01); H01L 23/04 (2013.01); H01L 23/043 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54473 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01)

Combination set (CPC)

  1. H01L 2924/1305 + H01L 2924/00
  2. H01L 2924/1301 + H01L 2924/00
  3. H01L 2924/12042 + H01L 2924/00

Citation (search report)

  • [X] US 3972062 A 19760727 - HOPP GENE P
  • [XA] US 4646129 A 19870224 - YERMAN ALEXANDER J [US], et al
  • [XA] US 2964431 A 19601213 - KALISH ISRAEL H, et al
  • [A] US 5139972 A 19920818 - NEUGEBAUER CONSTANTINE A [US], et al
  • [A] US 5311059 A 19940510 - BANERJI KINGSHUK [US], et al
  • [A] PATENT ABSTRACTS OF JAPAN vol. 013, no. 574 (E - 863) 19 December 1989 (1989-12-19)
  • [A] "THERMALLY CONDUCTIVE SUBSTRATE MOUNTED MULTI-CHIP MODULE CAP", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, VOL. 36, NR. 9B, PAGE(S) 623-624, ISSN: 0018-8689, XP000397284
  • [A] PATENT ABSTRACTS OF JAPAN vol. 011, no. 095 (E - 492) 25 March 1987 (1987-03-25)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

EP 0978871 A2 20000209; EP 0978871 A3 20011219; JP 2000082816 A 20000321

INPADOC legal status


2003-03-26 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20020620

2002-09-11 [AKX] PAYMENT OF DESIGNATION FEES

- Free text: DE FR GB IT

2001-12-19 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A3

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2001-12-19 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO:

- Free text: AL;LT;LV;MK;RO;SI

2000-02-09 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): DE FR GB IT

2000-02-09 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2000-02-09 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO:

- Free text: AL;LT;LV;MK;RO;SI