EP 0979528 A1 20000216 - METHOD FOR MAKING CONNECTION BALLS ON ELECTRONIC CIRCUITS OR COMPONENTS
Title (en)
METHOD FOR MAKING CONNECTION BALLS ON ELECTRONIC CIRCUITS OR COMPONENTS
Title (de)
HERSTELLUNGSVERFAHREN FÜR VERBINDUNGSKUGELN AUF SCHALTUNGEN ODER ELEKTRONISCHE BAUELEMENTE
Title (fr)
PROCEDE DE REALISATION DE BILLES DE CONNEXION SUR DES CIRCUITS OU DES COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- FR 9800837 W 19980427
- FR 9705435 A 19970428
- FR 9707819 A 19970624
Abstract (en)
[origin: FR2762715A1] The invention concerns a method for producing and soldering electrical connection balls (1) on mounting lands (2) for electronic circuit or component (3) electrical connection. The invention further concerns the device for implementing said method. The invention is characterised in that it essentially comprises the following steps: the operations for filling the stencil screen openings (4) by means of a squeegee (6) or the like and hot refusion are carried out with the stencil screen positioned above the substrate; the stencil screen (4) positioned on the component (3) during refusion is separated from the component after refusion but before the balls (1) are solidified, the latter being still in liquid state such that the balls that are being formed acquire their balanced position and their strictly identical spherical shape whatever their number; after the balls are solidified, the denatured binder is cleaned out.
IPC 1-7
IPC 8 full level
H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 21/68 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP US)
H01L 21/4853 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 24/11 (2013.01 - EP US); H01L 24/12 (2013.01 - EP US); H05K 3/3485 (2020.08 - EP US); H01L 2224/11003 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/11848 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H05K 3/1216 (2013.01 - EP US); H05K 2201/035 (2013.01 - EP US); H05K 2203/043 (2013.01 - EP US); H05K 2203/0557 (2013.01 - EP US); H05K 2203/0577 (2013.01 - EP US)
Citation (search report)
See references of WO 9849725A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
FR 2762715 A1 19981030; FR 2762715 B1 20000721; AU 7535698 A 19981124; CA 2287249 A1 19981105; EP 0979528 A1 20000216; JP 2002514352 A 20020514; US 6689412 B1 20040210; WO 9849725 A1 19981105
DOCDB simple family (application)
FR 9707819 A 19970624; AU 7535698 A 19980427; CA 2287249 A 19980427; EP 98922871 A 19980427; FR 9800837 W 19980427; JP 54666398 A 19980427; US 40359800 A 20000828