EP 0980409 A1 20000223 - ADHESIVE COMPOSITIONS THAT ARE REMOVABLE AFTER THERMOSETTING
Title (en)
ADHESIVE COMPOSITIONS THAT ARE REMOVABLE AFTER THERMOSETTING
Title (de)
NACH HITZEHÄRTUNG ABNEHMBARE KLEBSTOFFZUSAMMENSETZUNGEN
Title (fr)
COMPOSITIONS ADHESIVES ENLEVABLES APRES THERMODURCISSEMENT
Publication
Application
Priority
US 9707505 W 19970505
Abstract (en)
[origin: WO9850480A1] Thermosettable adhesive compositions that include a polyepoxide resin, a curing agent, and a plurality of microspheres. The microspheres, polyepoxide resin, and curing agent and the relative amounts thereof, are selected such that upon cure the composition is capable of forming a semi-structural bond to a substrate and is cleanly thermally removable from the substrate.
IPC 1-7
IPC 8 full level
C09J 5/00 (2006.01); C09J 7/00 (2006.01); C09J 7/02 (2006.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 133/08 (2006.01); C09J 163/00 (2006.01)
CPC (source: EP US)
C09J 7/10 (2017.12 - EP US); C09J 7/35 (2017.12 - EP); C09J 163/00 (2013.01 - EP US); C09J 2301/412 (2020.08 - EP); C09J 2463/00 (2013.01 - EP)
Citation (search report)
See references of WO 9850480A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 9850480 A1 19981112; AU 3058497 A 19981127; EP 0980409 A1 20000223; JP 2001523295 A 20011120
DOCDB simple family (application)
US 9707505 W 19970505; AU 3058497 A 19970505; EP 97925450 A 19970505; JP 54799498 A 19970505